Principal Process Engineer - Nano Diffusion #3848 - USA-Arizona, United States
Originally posted 7 May 2026 by the employer.
About the role
Lead the design and execution of experiments, interpreting complex data sets to optimize the manufacturing process and achieve precision control at atomic levels. This role focuses on nano diffusion, ion implant technology transfer, and module integration across N4, N3, and N2 process technologies.
What you'll do
- Apply statistical process control methods to establish and sustain a robust manufacturing process. - Supervise the installation and maintenance of manufacturing equipment to expand capacity with punctuation and quality. - Collaborate with equipment and material suppliers to identify technology gaps and deficiencies, evaluating and qualifying mitigation and continuous improvement solutions. - Review and support the work of Process Engineers, providing technical guidance and performance feedback. - Coordinate with device, integration, defect reduction, lithography, etch, and thin films teams to execute integrated module development.
What you'll need
- Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science, or related field with 3 years of engineering experience (or Bachelor's with 5 years of postbaccalaureate, progressive engineering experience). - 2 years of experience with semiconductor process engineering. - 2 years of experience in at least 2 of: Design of Experiment (DOE), statistical process control, or statistical methods for modeling multivariate data sets. - 2 years of experience in at least 2 semiconductor metrology techniques: TEM, SEM, CD-SEM, EDS, FIB, AFM, XRD, Emission Spectroscopy, Raman Spectroscopy, Spectroscopic Ellipsometry, Quartz PCI, or FT-IR. - 2 years of experience in at least 3 of: wafer cross section techniques, wafer fabrication processes, ion transport phenomena, DRAM, plasma etching, plasma simulation, semiconductor thin film deposition, ALD, 3D NAND Flash, CVD, or PECVD. - 1 year of experience in semiconductor 28nm-4nm tech node ion implant technology transfer and production line setup, including implant dose measurement equipment installation, qualification, and maintenance. - 1 year of experience managing semiconductor process material costs, usage control, and 2nd source CIP evaluation. - Willingness and ability to work on-site at the Phoenix, Arizona facility.
This role has been open 163 days — well above the 54-day median for Semiconductor Equipment Engineering roles.
Semiconductor Equipment Engineering · Manufacturing Equipment
|
Open roles in category
3894
|
Median days open
54 d
|
Median salary
$126k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | TSMC Arizona | All employers we track in this specialty (3894 roles · 84 employers) |
|---|---|---|
| Open roles in this specialty | 42 | 3894 |
| Open roles in the wider Process, Fab & Equipment family | 92 | 10039 · 106 employers |
| Median days open | 163 d | 54 d (+109 d vs this employer) |
| Median salary (USD postings) | — | $126k |
Who's hiring in this category
- Applied Materials · 637 open roles · median 54 d
- Lam Research · 571 open roles · median 39 d
- KLA Corporation · 288 open roles · median 66 d
- Micron Technology · 278 open roles · median 47 d
- ASML · 186 open roles · median 74 d
- ASM International · 156 open roles · median 82 d
How we counted: 3894 open Semiconductor Equipment Engineering (Manufacturing Equipment) roles from 84 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.