Principal Process Engineer Job#5277
Work on advanced semiconductor fabrication across N4, N3, and N2 process technologies.
About the role
As a Principal Process Engineer, you will work closely with device, integration, defect reduction, lithography, etch, and thin films teams to drive integrated module development, control, and manufacturing process optimization.
What you'll do
- Apply statistical process control methods to establish and sustain a robust manufacturing process.
- Supervise the installation and maintenance of manufacturing equipment to expand capacity with punctuation and quality.
- Collaborate with equipment and material suppliers and partners to identify technology gaps and deficiencies, and evaluate and qualify mitigation and continuous improvement solutions.
- Lead the design and execution of experiments, interpreting and extracting results from complex data sets to optimize manufacturing processes and achieve precision control at atomic levels.
What you'll need
- Master’s degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, Chemistry, Materials Science, or a related field with 3 years of engineering experience (or a Bachelor’s degree with 5 years of progressive post-baccalaureate engineering experience).
- 2 years of experience with semiconductor process engineering.
- 2 years of experience in at least 2 of: Design of Experiment (DOE); statistical process control; or statistical methods for modeling multivariate data sets.
- 2 years of experience in at least 2 of: Transmission Electron Microscopy (TEM); Scanning Electron Microscopy (SEM); Critical Dimension SEM (CD-SEM); Energy Dispersive X-ray Spectroscopy (EDS); Focused Ion Beam (FIB); Atomic Force Microscopy (AFM); X-ray Diffraction (XRD); Emission Spectroscopy; Raman Spectroscopy; Spectroscopic Ellipsometry; Quartz PCI; or Fourier Transform Infrared Spectroscopy (FT-IR).
- 2 years of experience in at least 3 of: wafer cross section techniques; wafer fabrication processes; ion transport phenomena; dynamic random-access memory (DRAM); plasma etching; plasma simulation; semiconductor thin film deposition; Atomic Layer Deposition (ALD); 3D NAND Flash; Chemical Vapor Deposition (CVD); or Plasma Enhanced Chemical Vapor Deposition (PECVD).
- 1 year of experience leading projects and providing career and performance feedback to junior engineers and technicians.
More semiconductor jobs: TSMC Arizona jobs · Equipment engineering jobs
First seen in our index 13 days ago, well below the 55-day median for Semiconductor Equipment Engineering roles.
Semiconductor Equipment Engineering · Manufacturing Equipment
|
Open roles in category
3941
|
Median days since first seen
55 d
|
Category median salary (all employers)
$118k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | TSMC Arizona | All employers we track in this specialty (3941 roles · 87 employers) |
|---|---|---|
| Open roles in this specialty | 53 | 3941 |
| Open roles in the wider Process, Fab & Equipment family | 106 | 10371 · 119 employers |
| Median days since first seen | 163 d | 55 d (−108 d vs this employer) |
| Median salary (USD postings) | n/a | $118k |
Who's hiring in this category
- Applied Materials · 675 open roles · median 55 d
- Lam Research · 548 open roles · median 44 d
- KLA Corporation · 316 open roles · median 57 d
- Micron Technology · 253 open roles · median 59 d
- ASML · 197 open roles · median 79 d
- ASM International · 165 open roles · median 77 d
How we counted: 3941 open Semiconductor Equipment Engineering (Manufacturing Equipment) roles from 87 employers tracked in the SemiconductorJobs index, counted 12 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Process, Fab & Equipment family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.