Principal Photonics Integration Engineer - Boise, ID - Main Site, United States

Originally posted 20 August 2026 by the employer.

This role focuses on silicon photonics and heterogeneous integration technologies.

About the role

This Principal Photonics Integration Engineer will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. The role combines process integration, advanced packaging, and device development to bring new technologies from concept through manufacturing readiness.

What you'll do

• Develop and optimize end-to-end process integration flows for silicon photonics technologies.
• Lead integration and process development for photonic devices, optical interconnects, advanced packaging solutions, and heterogeneous integration architectures.
• Drive process characterization, DOE execution, yield improvement, defect reduction, root cause investigations, and process optimization activities.
• Partner with design, device, packaging, manufacturing, and supplier teams to support design rule development, tapeouts, and technology transfers.
• Lead technical programs, technology roadmaps, and AI-enabled engineering initiatives.

What you'll need

• PhD in Electrical Engineering, Materials Science, Physics, Photonics, Semiconductor Engineering, or a related field with over 3 years of industry experience; or Master's with more than 5 years; or Bachelor's with upwards of 7 years of industry experience.
• Experience integrating silicon photonics processes in semiconductor development or manufacturing environments.
• Strong knowledge of semiconductor process integration, wafer fabrication, process characterization, DOE methodology, and statistical analysis.
• Experience with process flow architecture, device integration, design rule development, and tape out execution.
• Demonstrated success leading multi-functional technical projects and using data-driven approaches to solve engineering challenges.

Nice to have

• Experience with silicon photonics, III-V semiconductor technologies, and heterogeneous integration platforms.
• Experience with advanced packaging technologies including hybrid bonding, wafer bonding, optical interposers, co-packaged optics, and optical packaging.
• Knowledge of optical interconnect technologies for datacenter, networking, AI accelerator, HPC, or memory applications.
• Experience applying AI, machine learning, advanced analytics, or workflow automation to engineering and manufacturing challenges.

Skills: silicon photonics, heterogeneous integration, photonic devices, optical interconnects, process integration flows, advanced packaging