Principal Package Engineer - Zhubei, Hsinchu County, Taiwan
Originally posted 22 September 2026 by the employer — open 0 days.
This role focuses on image sensor packaging technology development.
About the role
This Principal Package Engineer role manages image sensor packaging technology development, process improvement, and new product introduction for CSP, BGA, LGA, and related packages for sensing systems. This includes direct support for corporate product and technology development.
What you'll do
- Manage image sensor packaging technology development and new product introduction.
- Drive process improvement for various package types, including CSP, BGA, and LGA.
- Support corporate product and technology development initiatives.
- Develop analytical techniques for evaluating new package designs and technologies.
- Utilize quantitative and qualitative approaches, including statistical analysis and design of experiments, for evaluations.
- Interact with business units, engineering teams, operations, material suppliers, and subcontract assembly service providers.
What you'll need
- Master’s degree or above in Engineering, Physics, Chemistry or Materials.
- Master’s with 8+ years or PhD with 4+ years in semiconductor assembly packaging development, process engineering, materials development, and new product introduction.
- Experience with image sensor packaging and related sensor packaging.
- Experience in wafer level CSP assembly and TSV-related processes.
- Solid understanding of packaging materials and properties.
- Proven experience utilizing statistical analysis techniques such as DOE.
- Understanding of package reliability requirements for consumer, industrial, medical, and automotive applications.
- Bilingual in English and Mandarin Chinese.
- Basic to intermediate proficiency in AI tools such as ChatGPT, Microsoft Copilot, or similar platforms.
Nice to have
- Experience with die attach, wire bonding and molding for BGA related packaging.
Skills: image sensor packaging, wafer level CSP, TSV, die attach, wire bonding, molding
This role has been open 0 days — well below the 57-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
296
|
Median days open
57 d
|
Median salary
$172k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (296 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 15 | 296 |
| Open roles in the wider Process, Fab & Equipment family | 282 | 9388 · 108 employers |
| Median days open | 13 d | 57 d (−44 d vs this employer) |
| Median salary (USD postings) | — | $172k |
Skills observed across this category: image sensor packaging, wafer level CSP, TSV, die attach, wire bonding, molding
Who's hiring in this category
- KLA Corporation · 49 open roles · median 103 d
- Micron Technology · 37 open roles · median 32 d
- Infineon Technologies · 19 open roles · median 42 d
- Renesas Electronics · 19 open roles · median 22 d
- Lumilens · 13 open roles · median 46 d
- onsemi (this employer) · 13 open roles · median 25 d
How we counted: 296 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.