Principal Package Competence Engineer - Manchester, United Kingdom
Originally posted 25 August 2026 by the employer — open 23 days.
Advance semiconductor packaging technologies for the Power MOSFET portfolio.
About the role
This role focuses on advancing semiconductor packaging technologies and leading package development, assembly technologies, and strategic technology initiatives. You will enhance the performance, reliability, and competitiveness of the Power MOSFET portfolio.
What you'll do
- Lead package design studies and development activities for new and existing semiconductor products.
- Serve as an expert in semiconductor packaging and assembly technologies.
- Evaluate emerging package and process technologies.
- Support the validation of new package concepts through simulation and technical studies.
- Contribute to package strategy development and long-term technology roadmaps.
- Lead technical projects related to package development, qualification, and process freeze activities.
What you'll need
- PhD with 5+ years, or Bachelor's/Master's degree with 8+ years of relevant semiconductor experience.
- Extensive experience in semiconductor packaging and assembly technologies.
- Experience in power semiconductor technologies and applications.
- Proven track record of package innovation, technology development, or patent generation.
- Strong understanding of semiconductor package materials, assembly processes, and reliability requirements.
- Experience with failure analysis, reliability testing, and root-cause investigations.
- Expertise in design of experiments (DOE), data analysis, and technical problem solving.
- Experience using advanced package design and simulation tools.
Skills: semiconductor packaging, assembly technologies, package design studies, package strategy, power MOSFET portfolio
This role has been open 23 days — well below the 64-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
199
|
Median days open
64 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Nexperia | All employers we track in this specialty (199 roles · 40 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 199 |
| Open roles in the wider Process, Fab & Equipment family | 84 | 9320 · 108 employers |
| Median days open | 69 d | 64 d (+5 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: semiconductor packaging, assembly technologies, package design studies, package strategy, power MOSFET portfolio
Who's hiring in this category
- Infineon Technologies · 29 open roles · median 28 d
- Micron Technology · 21 open roles · median 139 d
- Renesas Electronics · 19 open roles · median 21 d
- Intel Corporation · 12 open roles · median 145 d
- Monolithic Power Systems · 12 open roles · median 181 d
- onsemi · 7 open roles · median 61 d
How we counted: 199 open Packaging Engineering (Packaging) roles from 40 employers tracked in the SemiconductorJobs index, counted 17 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.