Originally posted 24 June 2026 by the employer — open 78 days.
This role focuses on 3D sensing, including driver monitoring systems (DMS) and eye-tracking applications.
About the role
This role is for a Principal Image Sensor & Camera Systems Engineer specializing in Indirect Time-of-Flight (iToF) systems. The position drives the 3D sensing roadmap, developing models for iToF pixels and defining active illumination subsystems for depth cameras.
What you'll do
- Architect, write, and automate sensor models and validate iToF depth-calculation software pipelines.
- Collaborate in the development of iToF camera modules, evaluation boards, proof-of-concepts, and customer demonstrators.
- Establish engineering specifications for active illumination modules (VCSELs/LEDs), modulation frequencies, optical bandpass filters, lenses, and specialized PCBs.
- Perform lab characterization of iToF modules, writing custom software scripts to analyze hardware test data, sensor noise, and depth accuracy.
- Translate client 3D sensing requirements into image sensor technologies.
What you'll need
- 5+ years of industry experience as a camera systems engineer, optical systems engineer, or 3D sensing engineer.
- Deep understanding of Indirect Time-of-Flight (iToF) sensor architectures, including continuous-wave modulation, demodulation pixels, and active illumination concepts.
- Strong proficiency in Python, MATLAB, or C/C++ applied to scientific computing, numerical analysis, pixel performance modeling, or depth-mapping software.
- Hands-on experience with active illumination camera systems such as depth cameras, driver monitoring systems (DMS), eye-tracking, or similar time-of-flight systems.
- M.Sc. or Ph.D. in Physics, Electrical Engineering, Computer Science, or a related field.
Nice to have
- Hands-on experience with CMOS Image Sensor (CIS) pixel performance modeling, numerical analysis of electro-optical devices, or semiconductor physics simulation.
- Experience in VCSEL/illumination optics design, iToF spatial/temperature calibration, or high-speed hardware board design.
Skills: iToF, image sensor, camera systems, active illumination, pixel performance modeling
This role has been open 77 days — well below the 130-day median for MEMS/Sensor Design roles.
MEMS/Sensor Design · Mems Sensors
|
Open roles in category
36
|
Median days open
130 d
|
Median salary
$164k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (36 roles · 13 employers) |
|---|---|---|
| Open roles in category | 1 | 36 |
| Median days open | 77 d | 130 d (−53 d vs this employer) |
| Median salary (USD postings) | — | $164k |
Skills observed across this category: iToF, image sensor, camera systems, active illumination, pixel performance modeling
Who's hiring in this category
- SiTime · 9 open roles · median 169 d
- STMicroelectronics · 7 open roles · median 149 d
- Analog Devices · 5 open roles · median 65 d
- Qualcomm · 4 open roles · median 72 d
- Infineon Technologies · 3 open roles · median 20 d
- AIXTRON · 1 open role · median 165 d
How we counted: 36 open MEMS/Sensor Design (Mems Sensors) roles from 13 employers tracked in the SemiconductorJobs index, counted 10 Sept 2026. Figures refresh nightly.