Principal High Speed Board Designer (TERADYNE, Agoura Hills, CA)
$197,800 - $316,400 USD yearly
Originally posted 21 October 2026 by the employer.
About the role
Teradyne's Silicon Technology Engineering team is seeking a Principal High-Speed Board Designer to lead the design and development of prototype and system characterization hardware for ASIC platforms. The role focuses on co-designing the complete signal path across ASIC packages, PCB interconnects, connectors, cables, and instrument interfaces.
What you'll do
- Lead the architecture, design, layout, and bring-up of high-speed characterization and prototype boards for custom ASIC programs. - Develop independent system characterization platforms to validate ASIC performance ahead of instrument readiness. - Co-design the complete signal path across ASIC packages, PCB interconnect, connectors, cables, instrument interfaces, test fixtures, and sockets. - Partner with ASIC, package, SI, and system teams to optimize signal integrity, power integrity, timing, and overall system performance. - Perform channel analysis, loss budgeting, and design tradeoff studies for high-speed serial links. - Drive board bring-up, debugging, root-cause analysis of electrical and system-level issues, and silicon characterization measurement methodologies.
What you'll need
- BS or MS in Electrical Engineering or a related field. - 8+ years of experience designing high-performance digital and mixed-signal circuit boards. - Expertise in high-speed PCB design for data rates of 25 Gbps and above. - Hands-on lab experience with oscilloscopes, VNAs, TDR/TDT, BERTs, and high-speed measurement equipment. - Experience supporting ASIC silicon bring-up and characterization. - Familiarity with electromagnetic simulation tools, including Ansys HFSS and Keysight ADS. - Knowledge of advanced packaging technologies, chiplets, and heterogeneous integration, along with understanding of DFM, DFT, and volume production requirements.
This role has been open 0 days — well below the 51-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
992
|
Median days open
51 d
|
Median salary
$154k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Teradyne | All employers we track in this specialty (992 roles · 104 employers) |
|---|---|---|
| Open roles in this specialty | 61 | 992 |
| Open roles in the wider Software, Firmware & Systems family | 108 | 6296 · 145 employers |
| Median days open | 34 d | 51 d (−17 d vs this employer) |
| Median salary (USD postings) | — | $154k |
Who's hiring in this category
- Intel Corporation · 76 open roles · median 33 d
- KLA Corporation · 63 open roles · median 47 d
- Teradyne (this employer) · 57 open roles · median 33 d
- NVIDIA · 52 open roles · median 68 d
- Applied Materials · 51 open roles · median 69 d
- AMD · 47 open roles · median 53 d
How we counted: 992 open Hardware Systems Engineering (AI ML Hardware) roles from 104 employers tracked in the SemiconductorJobs index, counted 21 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.