Principal Equipment Engineer (Multiple Positions) #9938 - USA-Arizona, United States
Originally posted 31 March 2026 by the employer.
Retrofit component and parameter settings across lithography, diffusion, thin film, or etching equipment running N4, N3, and N2 process technologies.
About the role
Retrofit component and parameters settings to improve tool performance and availability for diffusion, thin film, lithography, or etching equipment in a clean room environment. TSMC Arizona's fabs run advanced process technologies including N4, N3, and N2.
What you'll do
- Solve critical equipment issues to improve tool uptime availability and utilization efficiency. - Implement best known methods in hardware to control tool performance and utilization. - Identify and pursue opportunities for hardware capability enhancement, driving defect reduction. - Install and qualify new tool sets according to planned schedules to add capacity in a timely manner. - Communicate with cross-function engineers or vendors, serving as a module liaison with facilities, vendor, and manufacturing shift personnel.
What you'll need
- Master’s degree in Electronics Engineering, Electrical Engineering, Mechanical Engineering, Material Science, Chemical Engineering, Automation Engineering or a related field plus 3 years of engineering experience, or a Bachelor’s degree in the same fields plus 5 years of progressive post-baccalaureate engineering experience. - 3 years of experience with semiconductor manufacturing principles, practices, and techniques relating to equipment engineering and maintenance. - 2 years of experience with 5nm technology or beyond in the logic chip semiconductor industry. - 1 year of experience overseeing junior engineers. - Experience with mechanical systems focused on semiconductor lithography track equipment robotics, pneumatics, and electrical systems. - Experience troubleshooting complex defect and hardware issues to resolve root causes, applying physics and chemistry principles to semiconductor lithography processes. - Willingness and ability to work on-site at the Phoenix, Arizona facility.
This role has been open 163 days — well above the 54-day median for Semiconductor Equipment Engineering roles.
Semiconductor Equipment Engineering · Manufacturing Equipment
|
Open roles in category
3894
|
Median days open
54 d
|
Median salary
$126k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | TSMC Arizona | All employers we track in this specialty (3894 roles · 84 employers) |
|---|---|---|
| Open roles in this specialty | 42 | 3894 |
| Open roles in the wider Process, Fab & Equipment family | 92 | 10039 · 106 employers |
| Median days open | 163 d | 54 d (+109 d vs this employer) |
| Median salary (USD postings) | — | $126k |
Who's hiring in this category
- Applied Materials · 637 open roles · median 54 d
- Lam Research · 571 open roles · median 39 d
- KLA Corporation · 288 open roles · median 66 d
- Micron Technology · 278 open roles · median 47 d
- ASML · 186 open roles · median 74 d
- ASM International · 156 open roles · median 82 d
How we counted: 3894 open Semiconductor Equipment Engineering (Manufacturing Equipment) roles from 84 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.