Principal Engineer, Thermo-Mechanical - US-CA - Santa Clara, United States
Originally posted 13 October 2026 by the employer.
Develop thermal and thermo-mechanical technologies for advanced semiconductor packaging platforms supporting AI, networking, silicon photonics, and co-packaged optics products.
About the role
This role involves leading the development of thermal and thermo-mechanical technologies for advanced semiconductor packaging platforms. You will work on enabling Marvell's AI, cloud, networking, silicon photonics, and co-packaged optics products.
What you'll do
- Lead development of thermal and thermo-mechanical technologies for advanced semiconductor packaging platforms.
- Define thermal architecture requirements and technology strategies for future products.
- Develop and evaluate advanced cooling solutions including TIMs, vapor chambers, liquid cooling, and package-integrated cooling.
- Perform thermal, structural, and thermo-mechanical analysis and establish simulation methodologies for advanced package development.
- Correlate simulation models with laboratory measurements, package characterization data, and reliability results.
- Investigate thermal and mechanical failure mechanisms including warpage, stress, deformation, delamination, fatigue, and material degradation.
What you'll need
- M.S. or Ph.D. in Mechanical Engineering, Materials Science, Engineering Mechanics, or a related engineering discipline.
- 10+ years of thermal, thermo-mechanical, advanced packaging, or semiconductor technology development experience.
- Demonstrated leadership developing thermal and thermo-mechanical solutions for advanced semiconductor packages and heterogeneous integration platforms.
- Deep understanding of heat transfer, structural mechanics, material behavior, package reliability, and failure mechanisms.
- Experience with advanced cooling technologies including TIMs, vapor chambers, liquid cooling, cold plates, immersion cooling, or package-integrated cooling solutions.
- Extensive experience with thermal and thermo-mechanical simulation tools such as ANSYS Mechanical, Icepak, Fluent, Abaqus, COMSOL, or equivalent platforms.
Nice to have
- Development experience supporting AI accelerators, networking products, silicon photonics, co-packaged optics, or other high-performance computing applications.
- Advanced packaging technologies including 2.5D/3D integration, chiplets, heterogeneous integration, hybrid bonding, and advanced substrates.
- Development of thermal design methodologies, design rules, or technology roadmaps for advanced semiconductor packaging.
- Experience working directly with customers to evaluate thermal requirements and technology solutions.
- Record of technical publications, patents, or industry leadership related to advanced packaging, thermal management, or reliability.
This role has been open 1 day — well below the 49-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
950
|
Median days open
49 d
|
Median salary
$156k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Marvell Technology | All employers we track in this specialty (950 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 20 | 950 |
| Open roles in the wider Software, Firmware & Systems family | 64 | 6164 · 146 employers |
| Median days open | 61 d | 49 d (+12 d vs this employer) |
| Median salary (USD postings) | — | $156k |
Who's hiring in this category
- Intel Corporation · 72 open roles · median 32 d
- KLA Corporation · 64 open roles · median 42 d
- Teradyne · 52 open roles · median 26 d
- NVIDIA · 50 open roles · median 67 d
- Applied Materials · 49 open roles · median 62 d
- AMD · 45 open roles · median 47 d
How we counted: 950 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 14 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.