Principal Engineer, Silicon Photonics Assembly - Westlake Village, CA, United States
Originally posted 30 September 2026 by the employer.
About the role
This role involves developing and qualifying assembly technologies for silicon photonics and co-packaged optics (CPO) products. The team focuses on advanced packaging and assembly technologies for Marvell's silicon photonics and co-packaged optics (CPO) products.
What you'll do
- Develop and qualify assembly technologies for silicon photonics and co-packaged optics (CPO) products.
- Lead process development, characterization, and design of experiments (DOE) to establish assembly capabilities and process windows.
- Collaborate with OSATs, equipment suppliers, and material vendors to evaluate new assembly processes, materials, and equipment.
- Drive root-cause analysis and resolution of assembly and reliability challenges.
- Provide technical leadership from early technology evaluation through prototype build and product qualification.
What you'll need
- M.S. or Ph.D. in Materials Science, Packaging Engineering, Mechanical Engineering, Manufacturing Engineering, or a related field.
- 10+ years of experience in advanced packaging, semiconductor assembly, or technology development.
- Proven track record developing and qualifying advanced package assembly technologies for complex semiconductor products.
- Strong expertise in assembly process development, package integration, and design for manufacturability.
- Experience collaborating with OSATs, equipment suppliers, and cross-functional engineering teams.
Nice to have
- Optical module integration experience.
- Co-packaged optics (CPO) experience.
This role has been open 1 day — well below the 55-day median for Process Integration roles.
Process Integration · Advanced Packaging
|
Open roles in category
83
|
Median days open
55 d
|
Median salary
$174k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Marvell Technology | All employers we track in this specialty (83 roles · 22 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 83 |
| Open roles in the wider Process, Fab & Equipment family | 13 | 9590 · 109 employers |
| Median days open | 1 d | 55 d (−54 d vs this employer) |
| Median salary (USD postings) | — | $174k |
Who's hiring in this category
- Micron Technology · 17 open roles · median 107 d
- Intel Corporation · 13 open roles · median 40 d
- GlobalFoundries · 10 open roles · median 100 d
- Renesas Electronics · 9 open roles · median 8 d
- Applied Materials · 8 open roles · median 37 d
- Lumilens · 4 open roles · median 55 d
How we counted: 83 open Process Integration (Advanced Packaging) roles from 22 employers tracked in the SemiconductorJobs index, counted 1 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.