$114,000 - $193,700 USD yearly
Own module-level performance for Reactive Ion Etch (RIE) manufacturing operations.
Originally posted July 17, 2026 by the employer.
About the role
This role is responsible for providing technical leadership and strategic direction for Reactive Ion Etch (RIE) manufacturing operations, owning module-level performance across safety, quality, yield, availability, cost, and output.
What you'll do
- Serve as the technical authority for RIE process and equipment performance across multiple technologies and toolsets.
- Develop and execute module strategy aligned to fab objectives for yield, availability, cycle time, cost, and quality.
- Architect control strategies utilizing SPC, FDC, APC, and advanced analytics.
- Drive systematic reduction of chronic tool and process issues through structured root-cause analysis.
- Develop business cases supporting capital investments, upgrades, and productivity projects.
- Lead cross-functional teams consisting of Process Engineering, Equipment Engineering, Manufacturing, Quality, Facilities, and Product Engineering.
What you'll need
- Bachelor's Degree in Chemical Engineering, Semiconductor Engineering, or a related technical discipline.
- Minimum 10 years of semiconductor manufacturing experience.
- Minimum 7 years in RIE Process Engineering, Equipment Engineering, or Module Engineering roles.
- Deep understanding of plasma etch processes and RIE equipment.
- Expertise in statistical process control (SPC).
- Experience with DOE methodology, Fault Detection and Classification (FDC), Advanced Process Control (APC), Yield Analysis, Root Cause Analysis, FMEA, and process qualification methodologies.
Nice to have
- Master's Degree or PhD in Engineering or Physical Sciences.
- Experience with TEL and/or Lam Research RIE platforms.
- Experience supporting automotive, power semiconductor, or image sensor technologies.
- Knowledge of chamber matching, endpoint systems, and advanced process control applications.
More semiconductor jobs: onsemi jobs · Hardware design jobs
First seen in our index 120 days ago, well above the 45-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1193
|
Median days since first seen
45 d
|
Category median salary (all employers)
$150k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (1193 roles · 113 employers) |
|---|---|---|
| Open roles in this specialty | 26 | 1193 |
| Open roles in the wider Software, Firmware & Systems family | 38 | 6710 · 162 employers |
| Median days since first seen | 43 d | 45 d (+2 d vs this employer) |
| Median salary (USD postings) | n/a | $150k |
Who's hiring in this category
- Intel Corporation · 94 open roles · median 32 d
- Applied Materials · 67 open roles · median 36 d
- KLA Corporation · 65 open roles · median 65 d
- NVIDIA · 62 open roles · median 77 d
- ASML · 59 open roles · median 22 d
- Teradyne · 57 open roles · median 56 d
How we counted: 1193 open Hardware Systems Engineering (AI ML Hardware) roles from 113 employers tracked in the SemiconductorJobs index, counted 14 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Software, Firmware & Systems family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.