Principal Engineer, HIG-HBM Design - Richardson, TX, United States
Originally posted 7 October 2026 by the employer.
About the role
This role involves crafting and analyzing digital and analog circuits for memory products, including simulating, optimizing, and floor planning DRAM circuits. You will proactively craft HBM products that optimize manufacturing functions and assure performance, power, cost, quality, reliability, time-to-market, and customer satisfaction.
What you'll do
- Craft and analyze digital and analog circuits used in the development of memory products
- Simulate, optimize, and floor plan DRAM circuits
- Collaborate with design and verification teams globally
- Support Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing groups
- Innovate and integrate front-end and backend processes with design, debugging, and qualification techniques
- Develop low power per bit solutions for ML (Machine Learning) and AI (Artificial Intelligence) applications
What you'll need
- Master’s degree in Electrical Engineering, Physics, Computer Engineering, Semiconductor Engineering or a related field and 10 years of experience
- High-speed memory design on data paths, from I/O interface to core array
- Power domain network analysis
- Memory test architectures like MBIST and production silicon validation
- Digital design methodologies experience including RTL design, synthesis, and physical implementation
- ASIC design development using digital design
- Memory core timing, latency control, and signal integrity consideration in advanced designs
Skills: HBM design, high-speed memory design, DRAM circuits, MBIST, RTL design
This role has been open 2 days — well below the 65-day median for Memory Design roles.
Memory Design · Memory Design
|
Open roles in category
303
|
Median days open
65 d
|
Median salary
$205k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (303 roles · 29 employers) |
|---|---|---|
| Open roles in this specialty | 153 | 303 |
| Median days open | 87 d | 65 d (+22 d vs this employer) |
| Median salary (USD postings) | — | $205k |
Skills observed across this category: HBM design, high-speed memory design, DRAM circuits, MBIST, RTL design
Who's hiring in this category
- Micron Technology (this employer) · 153 open roles · median 86 d
- Synopsys · 33 open roles · median 49 d
- Qualcomm · 18 open roles · median 92 d
- Broadcom · 17 open roles · median 50 d
- SanDisk · 17 open roles · median 36 d
- NVIDIA · 8 open roles · median 59 d
How we counted: 303 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 9 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.