Principal Engineer – 3D NAND Process Integration - Fab 10N/X, Singapore
Originally posted 22 September 2026 by the employer — open 0 days.
Driving the future 3D NAND technology roadmap.
About the role
This role involves driving the future NAND technology roadmap through advanced pathfinding and integration, bridging device concepts, materials, and process integration into manufacturable solutions.
What you'll do
- Drive 3D NAND integration and technology roadmap, leading pathfinding and advanced architecture enablement.
- Lead end-to-end development (conception → technology validation) including learning vehicles, characterization, and debug.
- Solve complex integration challenges using data-driven, AI-assisted, and model-based approaches.
- Define and optimize module/process architecture (electrical targets, process flows, design rules).
- Collaborate across Device, Probe, Test, Design, and Operations to drive performance, yield learning, and execution.
- Drive technical innovation through process improvements, patents, and publications.
What you'll need
- Strong foundation in semiconductor device physics and process integration.
- Experience in memory (NAND/DRAM), CMOS/logic, or emerging/embedded memory technologies.
- Proven ability in experiment design, data analysis, and problem-solving.
- Ability to work across cross-functional R&D teams.
- Strong communication and collaboration skills.
Nice to have
- Exposure to advanced data analytics or AI/ML techniques.
Skills: 3D NAND, process integration, technology roadmap, device concepts, yield learning
This role has been open 0 days — well below the 56-day median for Process Integration roles.
Process Integration · Process Integration
|
Open roles in category
218
|
Median days open
56 d
|
Median salary
$160k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (218 roles · 36 employers) |
|---|---|---|
| Open roles in this specialty | 78 | 218 |
| Open roles in the wider Process, Fab & Equipment family | 1462 | 9417 · 108 employers |
| Median days open | 57 d | 56 d (+1 d vs this employer) |
| Median salary (USD postings) | — | $160k |
Skills observed across this category: 3D NAND, process integration, technology roadmap, device concepts, yield learning
Who's hiring in this category
- Micron Technology (this employer) · 76 open roles · median 57 d
- GlobalFoundries · 24 open roles · median 91 d
- Intel Corporation · 15 open roles · median 56 d
- onsemi · 9 open roles · median 41 d
- Infineon Technologies · 8 open roles · median 41 d
- Renesas Electronics · 8 open roles · median 54 d
How we counted: 218 open Process Integration (Process Integration) roles from 36 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.