PDE PIE (Package Integration Engineering) Engineer - Penang, Malaysia - Grande, Malaysia
Originally posted 9 September 2026 by the employer — open 12 days.
About the role
This role involves leading and managing New Product Introduction (NPI) activities as a Product Owner, collaborating with cross-functional teams to achieve organizational and business objectives. You will be responsible for the entire Product Life Cycle, from NPI to EOL, focusing on bringing new products and packages into volume production.
What you'll do
- Drive the New Product Introduction process through NPI Phase Gate Review.
- Coordinate new product start-up to achieve first pass qualification.
- Work with process, equipment, manufacturing, and planning teams to bring new products and packages into volume production.
- Provide timely support for First silicon, Engineering samples, and Qual samples.
- Monitor product yield trend, QDR, and reliability to ensure assembly operation control.
- Develop new technology capabilities with Process, Equipment, and Development owners ahead of market needs.
What you'll need
- Bachelor's degree in Engineering (Mechanical, Material, Chemical, Electrical).
- Understanding of semiconductor package structures and package reliability concepts.
- Excellent data analysis, statistical analysis, and data interpretation skills.
- Proficient in JMP analysis.
- Ability to make sound data-driven decisions.
- Eager to learn technical knowledge in component test and/or module manufacturing process.
Skills: Package Integration Engineering, New Product Introduction, volume production, product yield trend, package reliability
This role has been open 12 days — well below the 55-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
55 d
|
Median salary
$179k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (299 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 36 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 1459 | 9346 · 108 employers |
| Median days open | 30 d | 55 d (−25 d vs this employer) |
| Median salary (USD postings) | — | $179k |
Skills observed across this category: Package Integration Engineering, New Product Introduction, volume production, product yield trend, package reliability
Who's hiring in this category
- KLA Corporation · 49 open roles · median 102 d
- Micron Technology (this employer) · 36 open roles · median 29 d
- Renesas Electronics · 21 open roles · median 21 d
- Infineon Technologies · 20 open roles · median 41 d
- Intel Corporation · 13 open roles · median 76 d
- Lumilens · 13 open roles · median 45 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 21 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.