PDE HBM NPI PE ASM SR/ Staff Engineer - Taichung - MTB, Taiwan
Originally posted 14 September 2026 by the employer — open 4 days.
About the role
This role involves identifying, diagnosing, and resolving assembly process-related problems within the semiconductor manufacturing environment, with a focus on High Bandwidth Memory (HBM) New Product Introduction (NPI) and assembly process engineering.
What you'll do
- Identify, diagnose, and resolve assembly process related problems.
- Coordinate and execute process, equipment, and material evaluation/optimization initiatives.
- Lead and participate in continuous yield improvement and cost reduction activities.
- Validate and fan out new process baselines qualified, including new process, tools, and materials for new product introduction.
- Support SPC/FDC/RMS/APC and site to site portability.
- Manage and audit material suppliers to achieve quality, cost, and risk management objectives.
What you'll need
- 1 year of experience in semiconductor manufacturing, packaging, or assembly processes.
- Ability to work in a cleanroom environment.
- Flexibility to support on-call rotations or shifts when critical production issues arise.
- Strong analytical thinking and proactive problem-solving mindset.
- High degree of self-motivation.
Skills: HBM, NPI, assembly process, yield improvement, semiconductor manufacturing
This role has been open 4 days — well below the 65-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
199
|
Median days open
65 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (199 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 19 | 199 |
| Open roles in the wider Process, Fab & Equipment family | 1454 | 9328 · 108 employers |
| Median days open | 141 d | 65 d (+76 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: HBM, NPI, assembly process, yield improvement, semiconductor manufacturing
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 30 d
- Micron Technology (this employer) · 19 open roles · median 141 d
- Renesas Electronics · 19 open roles · median 23 d
- Intel Corporation · 12 open roles · median 147 d
- Monolithic Power Systems · 12 open roles · median 183 d
- onsemi · 7 open roles · median 63 d
How we counted: 199 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.