PCB Designer, Staff
$62 - $93 USD hourly
Originally posted 13 April 2026 by the employer.
About the role
As a member of the Central Hardware Systems CAD layout department, you will design and document printed circuit board layouts conforming to manufacturing, industry standards, and Qualcomm design guidelines. The role focuses on advanced layout designs across Server, 6G, and compute platforms.
What you'll do
- Design PCB layouts for reference server and PC compute systems, including form factor accurate (FFA) test platforms and high-volume circuit boards. - Engineer high-speed, multi-layer stack-ups encompassing application processors, digital processors, RF/radio circuits, and power delivery networks. - Utilize advanced manufacturing techniques, including stacked micro-vias, sequential lamination, and small-pitch package design rules. - Collaborate with internal teams in the U.S. and design partners in India to deliver PWB solutions. - Liaise with internal stakeholders and external vendors to support PCB fabrication and assembly throughout the product lifecycle.
What you'll need
- 5 years of active involvement in PCB high speed design. - 5 years of active involvement in PCB design for HDI & high-density electronics packaging. - 2 years of experience in a PCB design role designing consumer-grade products or low volume test products utilizing latest generation processor chips & ICs. - Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools. - Proficiency in Siemens/Mentor Xpedition or Cadence Allegro PCB design software.
Nice to have
- Design experience across RF, Analog, and high-speed digital circuits including DDR5 & 6, HDMI, PCIe, SATA, MIPI, USB 2, 3.x, GigE, and LPDDR breakouts. - Experience working with various EMI mitigation techniques and practices. - Experience with IDF/EMN file exchange between mechanical and HW teams. - Knowledge of fabrication and assembly process capabilities, limitations, and vendor issue resolution.
Skills: PCB layouts, high-speed, multi-layer stack-ups, high-density electronics packaging, Design for Manufacture (DFM), Cadence Allegro, Siemens/Mentor Xpedition
This role has been open 200 days — well above the 112-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · Serdes Highspeed
|
Open roles in category
92
|
Median days open
112 d
|
Median salary
$200k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Qualcomm | All employers we track in this specialty (92 roles · 35 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 92 |
| Open roles in the wider Software, Firmware & Systems family | 735 | 6250 · 144 employers |
| Median days open | 200 d | 112 d (+88 d vs this employer) |
| Median salary (USD postings) | — | $200k |
Skills observed across this category: PCB layouts, high-speed, multi-layer stack-ups, high-density electronics packaging, Design for Manufacture (DFM), Cadence Allegro
Who's hiring in this category
- NVIDIA · 14 open roles · median 53 d
- Qualcomm (this employer) · 9 open roles · median 199 d
- AMD · 5 open roles · median 131 d
- Astera Labs · 4 open roles · median 38 d
- Intel Corporation · 4 open roles · median 14 d
- Keysight Technologies · 4 open roles · median 152 d
How we counted: 92 open Hardware Systems Engineering (Serdes Highspeed) roles from 35 employers tracked in the SemiconductorJobs index, counted 25 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.