Packaging Thermal and Mechanical Analysis Internship - Summer 2027
$53 USD hourly
Originally posted 11 November 2026 by the employer.
About the role
Join Lightmatter's Packaging team to build an AI-enabled framework combining physics-based simulation with machine learning for early package design exploration. The work focuses on predicting thermal solutions and warpage for upcoming products, proof-of-concepts, and test vehicles.
What you'll do
- Build a framework linking package design parameters such as geometry, materials, process, and thermal solutions to thermal performance and warpage outputs.
- Develop and evaluate physics-informed neural networks (PINNs), surrogate models, and reduced-order or analytical models for first-order predictions on new package concepts.
- Automate FEA and CFD setup, execution, and post-processing in Python to generate parametric datasets.
- Train and validate models against high-fidelity simulation and hardware data, quantifying accuracy and uncertainty.
- Plan and execute physical DOEs involving test setup, measurement, and analysis to study coupled thermal-structural-optical physics.
- Partner with packaging, thermal, and thermo-mechanical engineers to define requirements and adapt the framework to upcoming products.
What you'll need
- Current enrollment in an MS or PhD program in Mechanical Engineering or a related field.
- Coursework in heat transfer, fluid mechanics, FEA, CFD, numerical methods, and solid or fracture mechanics.
- Graduate research experience in multi-physics problems involving both modeling and experimental validation.
- Experience with thermal simulation tools (Icepak, Fluent, Flotherm) and structural simulation tools (Ansys, Abaqus, COMSOL).
- Proficiency in Python (or similar) for scripting, data processing, and simulation automation.
Nice to have
- Graduate research in electronic or semiconductor packaging.
- Familiarity with thermal-structural coupling, warpage, and package-level thermal management.
- Coursework in packaging, numerical methods, or machine learning.
- Experience with PINNs, scientific ML, or surrogate modeling of FEA/CFD data using PyTorch, TensorFlow, or JAX.
- Interest in photonics and co-packaged optics.
More semiconductor jobs: Lightmatter jobs · Hardware design jobs · Mountain View jobs
First seen in our index 0 days ago, well below the 44-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1157
|
Median days since first seen
44 d
|
Category median salary (all employers)
$148k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Lightmatter | All employers we track in this specialty (1157 roles · 108 employers) |
|---|---|---|
| Open roles in this specialty | 8 | 1157 |
| Open roles in the wider Software, Firmware & Systems family | 15 | 6583 · 158 employers |
| Median days since first seen | 70 d | 44 d (−26 d vs this employer) |
| Median salary (USD postings) | n/a | $148k |
Who's hiring in this category
- Intel Corporation · 93 open roles · median 34 d
- KLA Corporation · 66 open roles · median 62 d
- Applied Materials · 65 open roles · median 36 d
- NVIDIA · 62 open roles · median 75 d
- ASML · 58 open roles · median 21 d
- Teradyne · 58 open roles · median 53 d
How we counted: 1157 open Hardware Systems Engineering (AI ML Hardware) roles from 108 employers tracked in the SemiconductorJobs index, counted 12 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Software, Firmware & Systems family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.