Packaging Mechanical Design Internship - Summer 2027
$43 USD hourly
Build automated drawing and GD&T toolsets for Lightmatter's 3D-stacked photonics engine, Passage™.
Originally posted 11 November 2026 by the employer.
About the role
In this internship, you will build tools that automate how Lightmatter creates and checks mechanical drawings for advanced photonic packages. As a member of the Packaging team, you will develop toolsets to generate substrate and package drawings, run GD&T sanity checks, and support experiments on coupled thermal-structural-optical physics.
What you'll do
- Build tools to automate the creation of substrate and package drawings from package design data, reducing manual CAD and drafting effort.
- Develop automated GD&T sanity checks that catch common drawing errors before release, such as missing or inconsistent callouts, datum scheme issues, and tolerance conflicts.
- Work with packaging, substrate design, and system engineers to capture drawing requirements, templates, and conventions into repeatable workflows.
- Validate tools against existing released drawings and iterate based on engineering feedback.
- Plan and execute physical DOEs, including test setup, measurement, and data analysis, to investigate coupled thermal-structural-optical physics.
What you'll need
- Currently pursuing a BS or MS in Mechanical Engineering or a related field.
- Completed coursework in Engineering Drawing, Manufacturing Processes, Thermodynamics and Heat Transfer, Engineering Mechanics, Strength of Materials, Design of Machine Elements, or Computational Design.
- Programming proficiency in Python (or a similar language) for scripting, data processing, and automation.
- Familiarity with CAD tools such as SolidWorks or Creo.
- Hands-on prototyping experience building, iterating, and validating physical assemblies through coursework, capstone projects, research labs, or personal projects.
Nice to have
- Exposure to Geometric Dimensioning and Tolerancing (GD&T) and tolerance analysis concepts, including ASME Y14.5.
- Internships, capstone, thesis, or research projects involving precision mechanical assembly, optical systems, or microelectronics packaging.
- Experience using AI/ML tools or LLMs to build design automation workflows, such as automating tolerance analysis, CAD scripting, FMEA generation, or simulation post-processing.
More semiconductor jobs: Lightmatter jobs · Hardware design jobs · Mountain View jobs
First seen in our index 0 days ago, well below the 44-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1157
|
Median days since first seen
44 d
|
Category median salary (all employers)
$148k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Lightmatter | All employers we track in this specialty (1157 roles · 108 employers) |
|---|---|---|
| Open roles in this specialty | 8 | 1157 |
| Open roles in the wider Software, Firmware & Systems family | 15 | 6583 · 158 employers |
| Median days since first seen | 70 d | 44 d (−26 d vs this employer) |
| Median salary (USD postings) | n/a | $148k |
Who's hiring in this category
- Intel Corporation · 93 open roles · median 34 d
- KLA Corporation · 66 open roles · median 62 d
- Applied Materials · 65 open roles · median 36 d
- NVIDIA · 62 open roles · median 75 d
- ASML · 58 open roles · median 21 d
- Teradyne · 58 open roles · median 53 d
How we counted: 1157 open Hardware Systems Engineering (AI ML Hardware) roles from 108 employers tracked in the SemiconductorJobs index, counted 12 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Software, Firmware & Systems family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.