Packaging Engineering Intern MS/PhD - United States
Originally posted 2 September 2026 by the employer.
About the role
This role involves interfacing across various work areas and organizations to help with the design, development, and analysis of semiconductor packaging technologies. This includes participation in cross-functional teams to develop internal and external solutions for technologies like Wirebond, Flip Chip, Modules, SIPs, and other advanced packages.
What you'll do
- Interface across various work areas and organizations for packaging technology design, development, and analysis.
- Participate in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies.
- Cultivate packaging advancements through material, mechanical, thermal, and electrical characterization.
What you'll need
- Currently pursuing a Masters degree in Mechanical Engineering, Materials Science, Chemical Engineering, Optical Science, Electrical Engineering, or related field.
- Cumulative 3.0/4.0 GPA or higher.
Nice to have
- Coursework or research in semiconductor packaging/fabrication.
- Experience with AutoCAD design and FEM modeling.
- Strong fundamentals in heat transfer, thermodynamics, and stress analysis.
- Experience with Semiconductor MEMS/3D integration design and fabrication.
- Project experience in CVD, PVD, thin film deposition, electroplating, plasma etch, ML based package design, wafer bumping, or optical packaging.
- Experience with plating, adhesion, surface treatment process.
- Hands-on experience with semiconductor fabrication and characterization tools including VI Scopes, X-ray Inspection, materials characterization, and FA techniques.
This role has been open 21 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
300
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Texas Instruments | All employers we track in this specialty (300 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 4 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 224 | 9525 · 109 employers |
| Median days open | 17 d | 58 d (−41 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation · 51 open roles · median 105 d
- Micron Technology · 37 open roles · median 34 d
- Infineon Technologies · 19 open roles · median 44 d
- Renesas Electronics · 19 open roles · median 24 d
- onsemi · 15 open roles · median 15 d
- Lumilens · 13 open roles · median 48 d
How we counted: 300 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.