Packaging Engineer - Suzhou, China
Originally posted 7 September 2026 by the employer — open 15 days.
About the role
This senior Packaging Engineer role at AMD involves driving supplier engagement for external Flip Chip bumping/fan out/RDL/on substrate assembly manufacturing, focusing on key performance indices and enabling new capabilities.
What you'll do
- Drive supplier engagement for continuous improvement and new capabilities.
- Plan and drive New Product Introduction activities and ramp-up readiness.
- Drive external manufacturers on issue resolution and prevention.
- Execute special work requests and provide comprehensive reports.
- Monitor external manufacturing site performance regarding yield and out-of-control lots.
- Plan and execute change management from internal or external parties.
What you'll need
- Strong commitment to meeting deadlines and driving for solutions.
- Excellent cross-functional project management, conflict management, analytics, and troubleshooting skills.
- Strong knowledge in Bumping/fan out/RDL processes.
- Minimum 5 years of process development work leading to volume production in a Semiconductor ASIC facility.
- Familiarity with tools (AI agents, JMP, Minitab, failure analysis knowledge, package reliability knowledge) and industry standards (ESD, Jedec, Automotive).
- Bachelor/MS degree in Mechanical, Material, or Chemical Engineering.
Nice to have
- Flip Chip assembly experience.
- Advanced package experience.
Skills: flip chip bumping, fan out, RDL, on substrate assembly, new product introduction
This role has been open 15 days — well below the 39-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
66
|
Median days open
39 d
|
Median salary
$187k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | AMD | All employers we track in this specialty (66 roles · 24 employers) |
|---|---|---|
| Open roles in this specialty | 6 | 66 |
| Median days open | 28 d | 39 d (−11 d vs this employer) |
| Median salary (USD postings) | — | $187k |
Skills observed across this category: flip chip bumping, fan out, RDL, on substrate assembly, new product introduction
Who's hiring in this category
- Micron Technology · 13 open roles · median 144 d
- AMD (this employer) · 6 open roles · median 28 d
- Marvell Technology · 6 open roles · median 14 d
- Broadcom · 5 open roles · median 164 d
- NVIDIA · 5 open roles · median 39 d
- Amazon · 3 open roles · median 13 d
How we counted: 66 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 24 employers tracked in the SemiconductorJobs index, counted 22 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.