Package Layout Engineer - Mountain View, CA, United States
$157,000 - $176,000 USD yearly
Originally posted 19 August 2026 by the employer.
About the role
What you'll do
- Deliver IC package substrate layouts for standard and advanced packaging technologies.
- Contribute to the product concept phase by delivering preliminary substrate designs and floorplanning.
- Collaborate with package substrate suppliers and Outsourced Semiconductor Assembly and Test (OSAT) companies.
- Generate fab files and coordinate with substrate suppliers and OSATs for Design for Manufacturing (DFM) and Design for Assembly (DFA) closure.
- Design package layouts adhering to signal integrity, power integrity, thermal, and mechanical requirements.
- Coordinate across functional teams to execute error-free Package Design Tape Outs on schedule.
What you'll need
- B.S. or M.S. degree in Electrical Engineering or similar discipline with at least 5 years of relevant experience.
- Minimum 3–5 years of experience in IC package layout design.
- Proficient with Allegro X APD.
- Understanding of IC package substrates and organic materials.
Nice to have
- Educational background in IC packaging and substrate layout design.
- Familiarity with system-level validation tools such as Cadence Integrity 3DIC.
- Familiarity with layout tools (e.g., Expedition Package Designer, Pads Layout, Altium).
- Experience with layout tool scripting languages (e.g., SKILL or Python).
- Exposure to early-stage architectural pathfinding and physical feasibility studies for multi-chiplet and advanced packaging architectures (2.5D/3D IC, Silicon Interposers, EMIB, Fan-Out Chip-on-Wafer).
- Experience evaluating floorplans, escape routing, bump patterns (micro-bumps / hybrid bonding), and die-to-die (D2D) interface topologies.
Skills: IC package substrate, advanced packaging, Allegro X APD, DFM, OSAT
This role has been open 58 days — well above the 44-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
69
|
Median days open
44 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Lightmatter | All employers we track in this specialty (69 roles · 26 employers) |
|---|---|---|
| Open roles in this specialty | 1 | 69 |
| Median days open | 58 d | 44 d (+14 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Skills observed across this category: IC package substrate, advanced packaging, Allegro X APD, DFM, OSAT
Who's hiring in this category
- Micron Technology · 10 open roles · median 167 d
- AMD · 9 open roles · median 42 d
- NVIDIA · 6 open roles · median 38 d
- Marvell Technology · 5 open roles · median 35 d
- Broadcom · 4 open roles · median 138 d
- GlobalFoundries · 4 open roles · median 106 d
How we counted: 69 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 26 employers tracked in the SemiconductorJobs index, counted 16 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.