Package Development Engineer - Taoyuan City
Packaging & Advanced Integration
Originally posted 25 September 2026 by the employer.
About the role
This role focuses on developing, optimizing, and sustaining advanced packaging processes for QFN/LGA assembly technologies.
What you'll do
- Develop, optimize, and characterize packaging processes for QFN and LGA technologies, including wafer thinning, dicing, and flip-chip bonding processes.
- Conduct process capability analysis (Cp/Cpk), implement statistical process control (SPC), and drive continuous improvement initiatives.
- Perform root cause analysis and implement corrective and preventive actions (8D methodology) for process-related issues.
- Collaborate with R&D, design, equipment, and manufacturing teams to ensure seamless process transfer.
- Define and maintain process specifications, control plans, and standard operating procedures (SOPs).
- Evaluate and qualify new materials, equipment, and processes to support technology roadmaps.
What you'll need
- Bachelor, Master, or PhD degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related discipline.
- Minimum of 5 years of experience in semiconductor packaging process engineering with QFN/LGA and Flip-chip bonding technologies.
- In-depth understanding of packaging process flows, equipment, and materials (e.g., photoresists, polymers, solders, underfills).
- Proficiency in statistical analysis software (e.g., JMP, Minitab) and data interpretation.
- Experience with failure analysis techniques (e.g., SEM, EDX, Optical Microscopy, X-ray).
- Fluency in English.
Market context
This role has been open 1 day — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
300
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | SiTime | All employers we track in this specialty (300 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 3 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 17 | 9460 · 108 employers |
| Median days open | 43 d | 58 d (−15 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation · 50 open roles · median 107 d
- Micron Technology · 35 open roles · median 33 d
- Infineon Technologies · 18 open roles · median 46 d
- Renesas Electronics · 18 open roles · median 22 d
- Intel Corporation · 15 open roles · median 83 d
- onsemi · 15 open roles · median 18 d
How we counted: 300 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 27 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.