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Micron Technology

Package Design and Development Quality Assurance Engineer - Data Analytics - Boise, ID - Main Site, United States

Micron Technology Boise, ID - Main Site, United States Full-time 12 days ago
Packaging & Advanced Integration

Originally posted 23 September 2026 by the employer.

Join a team focused on package technologies.

About the role

This role is responsible for improving the efficiency and effectiveness of new package technologies risk assessment through automation, data analysis, and machine learning/AI solutions. The position involves setting up databases, developing data ingestion pipelines, and implementing automated data analysis and reporting tools.

What you'll do

  • Improve efficiency and effectiveness by implementing automation, data analysis, and machine learning/AI solutions.
  • Set up databases, develop data ingestion pipelines, and implement automated data analysis and reporting tools.
  • Support problem solving and risk assessment for internal or customer quality issues by pulling and analyzing data.
  • Determine appropriate datasets and treatments to answer questions posed by problem solving teams.
  • Provide recommendations about root cause findings and product risk based on data analysis.
  • Share best practices with global teams to enable data-driven decision making.

What you'll need

  • Master’s degree in Computer Science or related field.
  • Statistical modeling and machine learning algorithms using Python.
  • Software quality assurance methodologies and software testing lifecycles.
  • Object-oriented programming languages including Python, Java, or C++, and object-oriented design principles.
  • SQL, relational database systems, and data modeling concepts.
  • Full-stack web development, including HTML, CSS, JavaScript, and modern frameworks (including React or Angular).
  • Designing and implementing algorithms and data structures.
  • Cloud computing platforms (including AWS), distributed systems, and networking fundamentals.

Skills: package technologies, data analysis, machine learning/AI, quality issue, reliability data

Market context

This role has been open 0 days — well below the 70-day median for Packaging Engineering roles.

Packaging Engineering · Packaging

Open roles in category
198
Median days open
70 d
Median salary
$167k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Micron Technology compares in Packaging Engineering hiring
Metric Micron Technology All employers we track in this specialty (198 roles · 42 employers)
Open roles in this specialty 18 198
Open roles in the wider Process, Fab & Equipment family 1468 9525 · 109 employers
Median days open 146 d 70 d (+76 d vs this employer)
Median salary (USD postings) — $167k

Skills observed across this category: package technologies, data analysis, machine learning/AI, quality issue, reliability data

Who's hiring in this category

  • Infineon Technologies · 29 open roles · median 35 d
  • Renesas Electronics · 20 open roles · median 27 d
  • Micron Technology (this employer) · 18 open roles · median 146 d
  • Monolithic Power Systems · 12 open roles · median 188 d
  • Intel Corporation · 11 open roles · median 153 d
  • onsemi · 8 open roles · median 51 d

How we counted: 198 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.

Apply now
Boise, ID - Main Site, United States
On-site
Full-time
12 days ago

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