Originally posted 6 August 2026 by the employer.
About the role
The Package & Board Electrical Design Engineer leads the electrical design of semiconductor packages and system boards for AI platforms. The scope spans die escape routing and package design through high-speed board architecture and system integration.
What you'll do
- Design package substrates for large SoCs, chiplet-based architectures, and multi-die systems.
- Develop package and board stackups that balance signal integrity, power integrity, manufacturability, thermal performance, and cost.
- Define escape routing strategies for high-density interfaces including HBM, UCIe, PCIe, Ethernet, and high-speed SerDes.
- Design high-speed server and accelerator boards supporting AI systems.
- Perform signal integrity and power integrity analysis across high-speed interfaces and power delivery networks.
- Support bring-up, debug, and characterization of prototype hardware through production.
What you'll need
- B.S. or M.S. in Electrical Engineering or equivalent experience.
- 5+ years of experience designing advanced package substrates, server boards, or high-speed computing systems.
- Experience with package design and PCB layout tools such as Cadence Allegro Package Designer, Allegro X, Siemens Xpedition, or equivalent.
- Strong understanding of signal integrity, power integrity, transmission line theory, and high-speed digital design.
- Experience with advanced package technologies including flip-chip, 2.5D integration, silicon interposers, chiplets, or high-density organic substrates.
- Experience working with high-speed interfaces such as PCIe, UCIe, Ethernet, DDR, HBM, or high-speed SerDes.
- Experience collaborating with silicon design, package engineering, manufacturing, and system architecture teams through product development.
Nice to have
- Experience designing accelerator, networking, or server-class hardware.
- Experience with SI/PI simulation tools such as Cadence Sigrity, Ansys SIwave, HFSS, ADS, or equivalent.
- Experience with advanced packaging technologies including EMIB, CoWoS, Foveros, or hybrid bonding.
- Familiarity with power delivery architecture for high-current AI accelerators.
- Experience supporting hardware bring-up, validation, and manufacturing.
More semiconductor jobs: Hardware design jobs · Hillsboro jobs
First seen in our index 0 days ago, well below the 47-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1150
|
Median days since first seen
47 d
|
Category median salary (all employers)
$148k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Mueon | All employers we track in this specialty (1150 roles · 109 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 1150 |
| Open roles in the wider Software, Firmware & Systems family | 3 | 6574 · 158 employers |
| Median days since first seen | 0 d | 47 d (+47 d vs this employer) |
| Median salary (USD postings) | n/a | $148k |
Who's hiring in this category
- Intel Corporation · 90 open roles · median 34 d
- KLA Corporation · 68 open roles · median 61 d
- NVIDIA · 61 open roles · median 74 d
- Teradyne · 59 open roles · median 53 d
- Applied Materials · 58 open roles · median 46 d
- ASML · 57 open roles · median 20 d
How we counted: 1150 open Hardware Systems Engineering (AI ML Hardware) roles from 109 employers tracked in the SemiconductorJobs index, counted 11 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Software, Firmware & Systems family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.