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Intel Corporation

Ocotillo Technology Fabrication Vacuum Systems Group (VSG) Experienced Module Engineer - Arizona, Phoenix, United States

Intel Corporation US, Arizona, Phoenix, United States 1 day ago
Digital Design & SoC Architecture

$103,730 - $198,820 USD yearly

Originally posted 14 October 2026 by the employer.

This Module Engineer role is specific to Ocotillo Technology Fabrication (OTF) Vacuum Systems Group (VSG).

About the role

This Module Engineer role involves developing a robust manufacturable process module within the Ocotillo Technology Fabrication (OTF) Vacuum Systems Group (VSG).

What you'll do

  • Define roadmaps to meet requirements, goals, and milestones for new technology processes.
  • Define and establish flow, procedures, and equipment configuration for the module.
  • Select and develop material and equipment for the process to meet quality, yield, reliability, cost, productivity, and manufacturability.
  • Plan and conduct experiments to fully characterize the process throughout the development cycle.
  • Drive improvements on quality, yield, reliability, process stability, productivity, and safety/ergonomics.
  • Establish process control systems for the module and sustain it through volume ramp.
  • Train production/receiving process engineers for transfer to other factories.
  • Transfer processes to high volume manufacturing and provide support for new factory start-up, installation, and qualification of new production lines.

What you'll need

  • Bachelor's degree with 4+ years of experience OR Master's degree with 2+ years of experience in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical, or a related engineering STEM field.
  • Semiconductor Engineering experience.
  • Experience supporting high-volume manufacturing ramps and technology transfers.

Nice to have

  • Experience working in a semiconductor factory as a technician or engineer prior to an Engineering role.
  • Statistics and experimental design skills to apply to tool matching, tool qualification, and process development.
  • Technical and troubleshooting experience.
Market context

This role has been open 0 days — well below the 49-day median for Hardware Systems Engineering roles.

Hardware Systems Engineering · AI ML Hardware

Open roles in category
950
Median days open
49 d
Median salary
$156k
See the full market breakdown ▾Category comparison, and who else is hiring
How Intel Corporation compares in Hardware Systems Engineering hiring
Metric Intel Corporation All employers we track in this specialty (950 roles · 102 employers)
Open roles in this specialty 71 950
Open roles in the wider Software, Firmware & Systems family 196 6164 · 146 employers
Median days open 33 d 49 d (−16 d vs this employer)
Median salary (USD postings) — $156k

Who's hiring in this category

  • Intel Corporation (this employer) · 72 open roles · median 32 d
  • KLA Corporation · 64 open roles · median 42 d
  • Teradyne · 52 open roles · median 26 d
  • NVIDIA · 50 open roles · median 67 d
  • Applied Materials · 49 open roles · median 62 d
  • AMD · 45 open roles · median 47 d

How we counted: 950 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 14 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.

Apply now
US, Arizona, Phoenix, United States
On-site
$103,730 - $198,820 USD yearly
1 day ago

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