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Intel Corporation

Ocotillo Technology Fabrication DSIRE (Diffusion) Module Engineer - Arizona, Phoenix, United States

Intel Corporation US, Arizona, Phoenix, United States 3 months ago
Digital Design & SoC Architecture

$89,010 - $170,630 USD yearly

Originally posted 29 July 2026 by the employer.

Join a team responsible for owning all aspects of the factory's 300mm toolsets.

About the role

As an Ocotillo Technology Fabrication (OTF) DSIRE (Diffusion) Module Engineer, you will develop a robust manufacturable process module within Intel's high-volume manufacturing facility in Chandler, Arizona. Your role will focus on owning and sustaining aspects of one or more of the factory's 300mm toolsets.

What you'll do

  • Own all aspects of one or more of the factory's 300mm toolsets.
  • Define roadmaps to meet requirements, goals, and milestones for new technology processes.
  • Plan and conduct experiments to characterize the process throughout the development cycle.
  • Drive continuous improvement in the health and matching of toolsets by maintaining an improvement roadmap.
  • Develop solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools.
  • Transfer process to high-volume manufacturing and provide support in new factory start-up.

What you'll need

  • Bachelor's degree in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical, or related engineering STEM field with 3+ years of experience, OR Master's degree in Electrical Engineering, Chemistry, Chemical Engineering, Mechanical, or related engineering STEM field with 1+ years of experience.
  • Experience supporting high-volume manufacturing ramps and technology transfers.
  • Semiconductor fabrication experience and sustaining semiconductor manufacturing toolsets (3+ years preferred).
  • Direct diffusion/implant module experience managing semiconductor equipment.
  • Proven track record with defectivity and availability improvements.

Nice to have

  • Experience working in a semiconductor factory as a technician or engineer.
  • Strong analytical and root-cause investigation skills.
  • Statistics and experimental design skills.
  • Technical and troubleshooting skills.
Market context

This role has been open 81 days — well above the 51-day median for Hardware Systems Engineering roles.

Hardware Systems Engineering · AI ML Hardware

Open roles in category
963
Median days open
51 d
Median salary
$156k
See the full market breakdown ▾Category comparison, and who else is hiring
How Intel Corporation compares in Hardware Systems Engineering hiring
Metric Intel Corporation All employers we track in this specialty (963 roles · 102 employers)
Open roles in this specialty 73 963
Open roles in the wider Software, Firmware & Systems family 204 6118 · 145 employers
Median days open 36 d 51 d (−15 d vs this employer)
Median salary (USD postings) — $156k

Who's hiring in this category

  • Intel Corporation (this employer) · 73 open roles · median 36 d
  • KLA Corporation · 65 open roles · median 44 d
  • Teradyne · 57 open roles · median 30 d
  • NVIDIA · 51 open roles · median 68 d
  • Applied Materials · 50 open roles · median 66 d
  • AMD · 47 open roles · median 50 d

How we counted: 963 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 18 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.

Apply now
US, Arizona, Phoenix, United States
On-site
$89,010 - $170,630 USD yearly
3 months ago

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