NPI Process Development Engineer - Kuala Lumpur, Malaysia
Originally posted 2 September 2026 by the employer.
About the role
This role involves developing and qualifying new LQFP and BGA packages for total assembly processes in automotive applications.
What you'll do
- Develop and qualify new LQFP and BGA packages.
- Drive quality, yield, cost, and process improvement activities.
- Create and maintain process documentation, process specifications, standard work instructions, OCAP, and QIT.
- Collaborate with cross-functional teams to resolve conflicts and make decisions for project risk mitigation.
- Work with upper management to align on scope and direction of key projects.
What you'll need
- 3-6 years of work experience with semiconductor assembly for automotive customers.
- Technical knowledge and hands-on experience in process characterization for laser dicing, plasma dicing, mechanical saw, die bond, wire bonding, mold, ball attach, marking, and singulation.
- Good SPC, Process Control, and other relevant statistical and problem-solving skills.
- Proficiency in Microsoft applications (PowerPoint, Excel Macro, Word).
Skills: semiconductor assembly, packing development, process characterization, die bond, wire bonding
This role has been open 22 days — well below the 70-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
198
|
Median days open
70 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | NXP Semiconductors | All employers we track in this specialty (198 roles · 42 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 198 |
| Open roles in the wider Process, Fab & Equipment family | 120 | 9525 · 109 employers |
| Median days open | 22 d | 70 d (−48 d vs this employer) |
| Median salary (USD postings) | — | $167k |
Skills observed across this category: semiconductor assembly, packing development, process characterization, die bond, wire bonding
Who's hiring in this category
- Infineon Technologies · 29 open roles · median 35 d
- Renesas Electronics · 20 open roles · median 27 d
- Micron Technology · 18 open roles · median 146 d
- Monolithic Power Systems · 12 open roles · median 188 d
- Intel Corporation · 11 open roles · median 153 d
- onsemi · 8 open roles · median 51 d
How we counted: 198 open Packaging Engineering (Packaging) roles from 42 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.