NPI Leadframe / Die Attach Manager - Muar, Malaysia
Originally posted 8 September 2026 by the employer — open 10 days.
About the role
This role leads new product introduction, process development, and material qualification activities for leadframe, substrate, and die attach technologies. The position drives process standardization, risk mitigation, and continuous improvement for assembly-related technologies.
What you'll do
- Lead and manage the NPI leadframe, substrate, and die attach process team.
- Own the technical execution of leadframe, substrate, and die attach material qualification.
- Define, evaluate, and challenge assembly design rules, process windows, and technical specifications.
- Drive process development, qualification planning, and validation activities for new materials, equipment, and manufacturing methods.
- Assess die attach equipment vendors, technical capabilities, tool performance, and process compatibility.
- Lead PFAS-free material qualification activities, ensuring compliance with environmental, regulatory, and customer requirements.
What you'll need
- PhD, Master’s, or Bachelor’s degree in Materials Engineering, Electronics, Chemical Engineering, Physics, or a related discipline.
- Minimum 10 years of relevant experience in semiconductor assembly, NPI, leadframe, substrate, or die attach processes.
- Strong technical background in leadframe, substrate, and die attach process development, qualification, or high-volume manufacturing.
- Experience in assembly material qualification, process transfer, and change management.
- Strong knowledge of process characterization, DOE, JMP, SPC, and structured problem-solving tools.
- Familiarity with die attach equipment performance, process capability, and vendor assessment.
- Understanding of assembly design rules, material behavior, and interactions between materials, process, and reliability.
What you'll need
- Strong project management skills.
- Proven analytical, troubleshooting, and decision-making capabilities.
- Strong communication, negotiation, and stakeholder management skills.
- Fluent in English, both written and spoken.
This role has been open 0 days — well below the 53-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
302
|
Median days open
53 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | STMicroelectronics | All employers we track in this specialty (302 roles · 58 employers) |
|---|---|---|
| Open roles in this specialty | 2 | 302 |
| Open roles in the wider Process, Fab & Equipment family | 269 | 9374 · 108 employers |
| Median days open | 2 d | 53 d (−51 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Who's hiring in this category
- KLA Corporation · 49 open roles · median 99 d
- Micron Technology · 36 open roles · median 26 d
- Renesas Electronics · 22 open roles · median 18 d
- Infineon Technologies · 20 open roles · median 38 d
- Intel Corporation · 14 open roles · median 58 d
- Lumilens · 13 open roles · median 42 d
How we counted: 302 open Packaging Engineering (Advanced Packaging) roles from 58 employers tracked in the SemiconductorJobs index, counted 18 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.