New Product Introduction - Dong Nai, Viet Nam, Vietnam
Originally posted 9 September 2026 by the employer — open 1 day.
This role focuses on Power module packaging.
About the role
This role involves introducing and maintaining assembly processes and activities for new product introduction, ensuring manufacturing and quality requirements are met.
What you'll do
- Introduce and maintain assembly processes and activities.
- Transfer, qualify, and ramp-up new product/package/technology.
- Provide engineering support for all activities in the product development process.
- Define risk assessment and risk mitigations, Bill of Material (BOM) selection, and process flow.
- Troubleshoot, investigate, and perform root cause analysis for qualification failures.
- Implement new products from engineering build to manufacturing environment using DOE, SIPOC, and Lean Six Sigma.
What you'll need
- BS/MS in Electrical, Mechanical Engineering, Material Engineering, Science and Technology, Chemistry, Physics or equivalent.
- Minimum of 5 years experience in semiconductor packaging and manufacturing.
- Experience in assembly processes of Plasma Cleaning, Coating, Molding, Plating Chemistry, Chemical Deflash, Trim and Form.
- Knowledge of Thermosetting Plastic such as Epoxy Molding Compound, Plating chemistry, Chemical deflash, Lead frame, Substrate, Direct Bond Copper Ceramic.
- Proficiency in Engineering Tools such as AutoCAD, 8D, SPC, DFMEA, DOE.
- Experience in Power module packaging, reliability, and chip package (CPI).
Nice to have
- Semiconductor or silicon/silicon carbide wafer processing experience.
- Experience in data analysis using JMP, Minitab, Power BI.
Skills: semiconductor packaging, assembly processes, new product/package/technology transfer, Design for Manufacturability, Power module packaging
This role has been open 1 day — well below the 59-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
289
|
Median days open
59 d
|
Median salary
$180k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | onsemi | All employers we track in this specialty (289 roles · 54 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 289 |
| Open roles in the wider Process, Fab & Equipment family | 264 | 9211 · 109 employers |
| Median days open | 84 d | 59 d (+25 d vs this employer) |
| Median salary (USD postings) | — | $180k |
Skills observed across this category: semiconductor packaging, assembly processes, new product/package/technology transfer, Design for Manufacturability, Power module packaging
Who's hiring in this category
- KLA Corporation · 49 open roles · median 96 d
- Micron Technology · 26 open roles · median 35 d
- Infineon Technologies · 25 open roles · median 34 d
- Renesas Electronics · 21 open roles · median 15 d
- Intel Corporation · 16 open roles · median 50 d
- Lumilens · 12 open roles · median 34 d
How we counted: 289 open Packaging Engineering (Advanced Packaging) roles from 54 employers tracked in the SemiconductorJobs index, counted 10 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.