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Micron Technology

New College Grad - DRAM Design Engineer

Micron Technology Boise, ID - Main Site, United States Full-time 3 months ago
Digital Design & SoC Architecture Memory & Storage Technologies

Originally posted 10 August 2026 by the employer. Relisted by the employer on 22 October 2026.

About the role

The Design Engineer is responsible for designing and analyzing digital and analog circuits for Micron memory products. This role supports silicon-to-systems development within Micron’s DRAM Design Engineering Group (DDEG) – Technology.

What you'll do

  • Design, analyze, and optimize digital, analog, memory, and logic circuits, including schematic development, layout, and verification.
  • Perform semiconductor design engineering activities including chip layout design, circuit checking, parasitic modeling, and documentation of specifications.
  • Support design validation, reticle experiments, tape-out revisions, and evaluation of semiconductor devices and components.
  • Lead layout efforts including floorplanning, placement, and routing, and modify designs based on product requirements and logic diagrams.
  • Collaborate with Product Engineering, Test, Probe, Process Integration, Assembly, Marketing, and verification teams.

What you'll need

  • Bachelor’s or Master’s degree in Electrical Engineering.
  • Experience in developing and evaluating digital and analog circuits for memory products.
  • Ability to model and simulate integrated circuits using SPICE and Verilog.
  • Working knowledge of Synopsys tools and Cadence Virtuoso.
  • Experience reviewing product specifications and logic flowcharts to define and implement semiconductor devices.
  • Experience working in AI-Enabled environments or willingness to leverage AI tools to support engineering productivity, automation, and data-driven workflows.

Nice to have

  • Experience in the design and development of volatile or nonvolatile memory technologies.
  • Knowledge of advanced memory technologies such as ferroelectric memory, wafer bonding, and advanced packaging.
  • Familiarity with small-signal sensing techniques.
  • Understanding of high-voltage reliability considerations in semiconductor devices.
  • Exposure to applying AI or AI Assisted techniques, including data-driven automation, to improve design or verification efficiency.

Skills: DRAM Design, Memory circuits, schematic development, layout, circuit checking

More semiconductor jobs: Micron Technology jobs

Market context

This role has been open 87 days — well above the 72-day median for Memory Design roles.

Memory Design · Memory Design

Open roles in category
302
Median days open
72 d
Category median salary (all employers)
$205k
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
How Micron Technology compares in Memory Design hiring
Metric Micron Technology All employers we track in this specialty (302 roles · 29 employers)
Open roles in this specialty 154 302
Median days open 81 d 72 d (+9 d vs this employer)
Median salary (USD postings) — $205k

Skills observed across this category: DRAM Design, Memory circuits, schematic development, layout, circuit checking

Who's hiring in this category

  • Micron Technology (this employer) · 154 open roles · median 82 d
  • Synopsys · 30 open roles · median 77 d
  • Qualcomm · 18 open roles · median 106 d
  • Broadcom · 16 open roles · median 78 d
  • SanDisk · 15 open roles · median 7 d
  • NVIDIA · 8 open roles · median 59 d

How we counted: 302 open Memory Design (Memory Design) roles from 29 employers tracked in the SemiconductorJobs index, counted 6 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.

Apply now
Boise, ID - Main Site, United States
On-site
Full-time
3 months ago

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