MTS - Thermal Simulation Engineer - Richardson, TX, United States
Originally posted 15 October 2026 by the employer.
Develop thermal and thermo-mechanical models for High Bandwidth Memory (HBM) products.
About the role
This role involves providing technical leadership in advanced thermal and thermo-mechanical modeling for High Bandwidth Memory (HBM) products. You will define simulation strategy and solve complex thermal challenges across 2.5D/3D semiconductor packaging systems.
What you'll do
- Lead the development of high-fidelity thermal and thermo-mechanical models for HBM packages, including die, interconnects, and bonding interfaces.
- Define and implement multiphysics simulation strategies encompassing thermal, structural, and coupled analyses.
- Provide deep technical analysis of thermal transport, heat flux distribution, and thermo-mechanical behavior across stacked memory architectures.
- Lead simulation-to-silicon correlation with characterization and test teams, establishing model validation criteria.
- Assess material properties, layout effects, package architecture, and manufacturing variation to identify key drivers of thermal resistance and hotspot behavior.
- Influence design, packaging, process, and test teams by translating simulation results into thermally-aware product requirements.
What you'll need
- PhD plus 5 years of industry experience, or Master’s degree plus 10 years of industry experience, in Mechanical Engineering, Materials Science, Physics, or a related field.
- Extensive industry experience in thermal simulation or multiphysics modeling for semiconductor devices or advanced packaging.
- Strong foundation in heat transfer, thermodynamics, and solid mechanics.
- Hands-on experience with multiphysics simulation tools (e.g., Ansys, Abaqus, Fluent, Star-CCM+, FloTHERM).
- Demonstrated expertise in modeling and interpreting thermo-mechanical phenomena such as thermal resistance, heat spreading, stress, warpage, and material interaction effects.
- Advanced experience with finite element modeling (FEM), coupled thermal-structural simulations, and model calibration.
Nice to have
- Understanding of semiconductor packaging technologies, including HBM, 2.5D/3D integration, TSVs, hybrid bonding, and interposers.
- Familiarity with material characterization and effective thermal property extraction across layered or heterogeneous systems.
- Knowledge of simulation-to-silicon calibration workflows and experimental validation techniques.
- Exposure to CFD or flow-based simulation for cooling or package-level heat transfer.
- Scripting or data analysis skills (Python, MATLAB, JMP) to automate simulations and analyze results.
This role has been open 1 day — well below the 51-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
953
|
Median days open
51 d
|
Median salary
$156k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (953 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 27 | 953 |
| Open roles in the wider Software, Firmware & Systems family | 258 | 6157 · 145 employers |
| Median days open | 52 d | 51 d (+1 d vs this employer) |
| Median salary (USD postings) | — | $156k |
Who's hiring in this category
- Intel Corporation · 68 open roles · median 34 d
- KLA Corporation · 64 open roles · median 44 d
- Teradyne · 56 open roles · median 28 d
- NVIDIA · 51 open roles · median 67 d
- Applied Materials · 49 open roles · median 64 d
- AMD · 47 open roles · median 48 d
How we counted: 953 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 16 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.