MTS Process Integration Engineer | APTD Die Level Technology - Boise, ID - Main Site, United States
Originally posted 25 September 2026 by the employer.
About the role
This role involves developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies within the Advanced Packaging Technology Development (APTD) department.
What you'll do
- Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects.
- Design and execute experiments to qualify materials, process flows, and design rules for new package architectures.
- Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics.
- Drive technology transfer, including process qualification, design rules, material selection, and manufacturing readiness.
- Predict and mitigate wafer/die warpage via modeling, cure‑shrinkage controls, and material/process levers, validating with inline metrology.
- Collaborate with design, process, equipment, reliability, test, and manufacturing teams to deliver high-performance packaging solutions.
What you'll need
- Bachelor’s degree in Materials Engineering, Chemical Engineering, or a related field with 8+ years of experience in advanced packaging technology development, 2.5D, 3D stacking, and HBM integration.
- Experience with TSVs, advanced interconnects, die stacking, underfill, molding, bonding, and package integration processes.
- Experience with hybrid bonding integration and reliability, including wafer-to-wafer or chip-to-wafer processes.
- Experience with HBM and logic integration, including thermal optimization.
Nice to have
- Master’s degree or PhD in Materials Engineering, Chemical Engineering, or a related field.
- Experience developing thermocompression bonding, microbump, or interposer-based packaging technologies.
- Experience using data analytics, automation, or AI-enabled workflows to improve engineering efficiency.
- Experience authoring technical papers, patents, or engineering documentation.
Skills: advanced packaging, 2.5D/3D stacking, HBM, hybrid bonding, process integration
This role has been open 22 days — well below the 62-day median for Process Integration roles.
Process Integration · Process Integration
|
Open roles in category
240
|
Median days open
62 d
|
Median salary
$161k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (240 roles · 40 employers) |
|---|---|---|
| Open roles in this specialty | 94 | 240 |
| Open roles in the wider Process, Fab & Equipment family | 1536 | 9874 · 109 employers |
| Median days open | 60 d | 62 d (−2 d vs this employer) |
| Median salary (USD postings) | — | $161k |
Skills observed across this category: advanced packaging, 2.5D/3D stacking, HBM, hybrid bonding, process integration
Who's hiring in this category
- Micron Technology (this employer) · 94 open roles · median 60 d
- GlobalFoundries · 28 open roles · median 74 d
- Intel Corporation · 13 open roles · median 22 d
- Infineon Technologies · 9 open roles · median 32 d
- NXP Semiconductors · 8 open roles · median 85 d
- SkyWater Technology · 8 open roles · median 30 d
How we counted: 240 open Process Integration (Process Integration) roles from 40 employers tracked in the SemiconductorJobs index, counted 17 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.