MTS/Principal Process Module Engineer - Advanced Packaging Program (2.5D and 3D Heterogeneous Integration) - Singapore
Originally posted 2 September 2026 by the employer.
About the role
This role involves developing and optimizing unit processes for advanced packaging, specifically focusing on 2.5D and 3D Heterogeneous Integration, and troubleshooting related process and tool issues. You will contribute to the setup of a 300mm Advanced Packaging Center in Singapore, with a focus on processes like bond & debond, plasma/UV cleaning, die reconstitution, annealing, and TSV for multi-stack bond wafers and die-to-wafer processes.
What you'll do
- Design, execute, and analyze experiments for advanced packaging etch processes to meet technology and manufacturing targets.
- Start up and qualify new processes and equipment within schedule, working with Equipment Engineers on acceptance and tool matching.
- Improve process robustness for high volume manufacturing using statistical tools, DOE techniques, data-driven decision making, and systematic problem-solving.
- Resolve complex technical issues within your module or related to yield.
- Support the Integration team and Quality organization to ensure technology meets qualification and reliability requirements.
- Coach and develop other engineers on advanced packaging Etch processes knowledge.
What you'll need
- BS, Master's Degree, or PhD in Electrical Engineering, Material Science & Engineering, Chemical Engineering, Physics, or another relevant engineering discipline.
- 4+ (PhD), 6+ (MSc), or 8+ (BSc) years of working experience in the advanced packaging industry.
- Experience leading fab-wide cross-modules process development and project coordination.
- Hands-on experience with advanced packaging (Si interposer, D2W, W2W) process tools.
- Excellent verbal and written communication skills.
- Strong interpersonal skills and ability to work effectively with different cultures.
This role has been open 22 days — well below the 58-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
300
|
Median days open
58 d
|
Median salary
$165k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | GlobalFoundries | All employers we track in this specialty (300 roles · 57 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 300 |
| Open roles in the wider Process, Fab & Equipment family | 297 | 9525 · 109 employers |
| Median days open | 75 d | 58 d (+17 d vs this employer) |
| Median salary (USD postings) | — | $165k |
Who's hiring in this category
- KLA Corporation · 51 open roles · median 105 d
- Micron Technology · 37 open roles · median 34 d
- Infineon Technologies · 19 open roles · median 44 d
- Renesas Electronics · 19 open roles · median 24 d
- onsemi · 15 open roles · median 15 d
- Lumilens · 13 open roles · median 48 d
How we counted: 300 open Packaging Engineering (Advanced Packaging) roles from 57 employers tracked in the SemiconductorJobs index, counted 24 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.