MTS - HBM Thermal Integration Engineer - Richardson, TX, United States
Originally posted 15 October 2026 by the employer.
Drive thermal performance optimization for High Bandwidth Memory (HBM) products.
About the role
This role drives thermal performance optimization for High Bandwidth Memory (HBM) products, sitting at the intersection of thermal simulation, silicon characterization, process technology, package development, manufacturing, test engineering, and product integration.
What you'll do
- Drive thermal performance optimization across HBM products through design, process, packaging, assembly, and test improvements.
- Develop and implement thermal learning plans, characterization strategies, and design-of-experiments (DOE).
- Analyze silicon characterization, inline metrology, manufacturing, and test data to identify key drivers of thermal behavior and variation.
- Partner with thermal simulation teams to improve understanding and correlation between predictive models and measured silicon performance.
- Work closely with wafer fabrication, package development, assembly, product engineering, and reliability teams to resolve thermal challenges.
- Drive cross-functional technical investigations and influence engineering decisions through data-driven analysis and structured problem solving.
What you'll need
- PhD with 5+ years or Master’s with 10+ years of industry experience in Mechanical Engineering, Materials Science, Physics, Semiconductor Engineering, Electrical Engineering, or related technical field.
- Hands-on experience in semiconductor product development within memory, logic, or advanced packaging technologies, with a background in Process Integration, Package Integration, Product Engineering, or Yield Engineering.
- Working knowledge of thermal simulation methodologies and multiphysics modeling approaches, with the ability to interpret simulation results and apply insights to silicon, package, and technology optimization.
- Experience designing, executing, and analyzing structured experiments and DOE-based investigations.
- Demonstrated ability to analyze large datasets, inline metrology data, characterization results, manufacturing data, and test results to identify performance drivers and sources of variation.
- Experience leveraging AI-enabled tools and workflows to analyze data, automate routine tasks, and improve decision-making.
Nice to have
- Understanding of HBM, advanced semiconductor packaging, 2.5D/3D integration, TSV technologies, hybrid bonding, interposers, and heterogeneous integration.
- Experience with thermal characterization and silicon validation techniques.
- Experience analyzing inline metrology, manufacturing, assembly, and test datasets using statistical methods.
- Knowledge of variation analysis, process optimization, and root-cause investigation methodologies.
- Familiarity with thermal simulation tools such as Ansys, Abaqus, Icepak, FloTHERM, Star-CCM+.
- Experience with Python, JMP, MATLAB, SQL, or similar data analysis environments.
- Experience leading cross-functional technology development initiatives in the semiconductor industry.
This role has been open 1 day — well below the 51-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
953
|
Median days open
51 d
|
Median salary
$156k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (953 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 27 | 953 |
| Open roles in the wider Software, Firmware & Systems family | 258 | 6157 · 145 employers |
| Median days open | 52 d | 51 d (+1 d vs this employer) |
| Median salary (USD postings) | — | $156k |
Who's hiring in this category
- Intel Corporation · 68 open roles · median 34 d
- KLA Corporation · 64 open roles · median 44 d
- Teradyne · 56 open roles · median 28 d
- NVIDIA · 51 open roles · median 67 d
- Applied Materials · 49 open roles · median 64 d
- AMD · 47 open roles · median 48 d
How we counted: 953 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 16 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.