Module Product Engineer - Tempe, United States
Originally posted 14 July 2026 by the employer. Relisted by the employer on 16 September 2026.
Power Towers and Vertical Power Stages for AI-focused power delivery.
About the role
The Module Product Engineer owns the technical readiness, manufacturability, and lifecycle performance of advanced power modules from New Product Introduction (NPI) through high-volume production and sustaining. Products include digital power VRMs, multiphase controllers, Smart Power Stages, Vertical Power Stages, and Power Towers.
What you'll do
- Own product engineering execution and manufacturability for advanced power modules from NPI through high-volume production, driving robust assembly processes across OSAT and internal manufacturing sites. - Establish and enforce assembly workmanship standards to ensure compliance with IPC-A-610. - Lead the resolution of assembly-related excursions, including die attach, clip attach, solder integrity, and module-level defects. - Lead product bring-up, characterization, and silicon readiness in partnership with Design, Test, and Applications teams. - Define and maintain product specifications, limits, and guard-bands based on silicon behavior and manufacturing capability. - Lead yield analysis, parametric trend monitoring, root-cause investigations, manufacturing release, qualification execution, and product change management (PCNs).
What you'll need
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field. - 8+ years of experience in semiconductor product engineering, manufacturing engineering, or test engineering, with demonstrated ownership from NPI through high-volume production. - Strong technical depth in semiconductor power products and advanced power module manufacturing. - Demonstrated knowledge of new product development, qualification, and high-volume manufacturing transfer. - Strong data analysis skills with the ability to interpret statistical results and drive engineering decisions.
Nice to have
- Master’s degree in a relevant engineering discipline. - Mechanical Engineering degree, particularly for module packaging, thermomechanical behavior, and assembly optimization.
This role has been open 97 days — well above the 52-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
973
|
Median days open
52 d
|
Median salary
$155k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (973 roles · 101 employers) |
|---|---|---|
| Open roles in this specialty | 12 | 973 |
| Open roles in the wider Software, Firmware & Systems family | 112 | 6222 · 145 employers |
| Median days open | 34 d | 52 d (−18 d vs this employer) |
| Median salary (USD postings) | — | $155k |
Who's hiring in this category
- Intel Corporation · 76 open roles · median 36 d
- KLA Corporation · 65 open roles · median 46 d
- Teradyne · 56 open roles · median 32 d
- NVIDIA · 52 open roles · median 67 d
- Applied Materials · 50 open roles · median 68 d
- AMD · 46 open roles · median 50 d
How we counted: 973 open Hardware Systems Engineering (AI ML Hardware) roles from 101 employers tracked in the SemiconductorJobs index, counted 20 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.