Power modules spanning Smart Power Stages (SPS), Vertical Power Stages, and Power Towers.
Originally posted 5 August 2026 by the employer. Relisted by the employer on 13 November 2026.
About the role
This role owns the technical readiness, manufacturability, and lifecycle performance of advanced power modules from New Product Introduction (NPI) through high-volume production and sustaining. The product scope covers digital power VRMs, multiphase controllers, Smart Power Stages (SPS), Vertical Power Stages, and Power Towers.
What you'll do
- Own product engineering execution and manufacturability for advanced power modules, driving assembly processes across OSAT and internal manufacturing sites.
- Establish and enforce assembly workmanship standards, ensuring compliance with IPC-A-610.
- Lead product bring-up, characterization, silicon readiness, and resolution of assembly excursions including die attach, clip attach, and solder integrity.
- Define and maintain product specifications, limits, and guard-bands based on silicon behavior and manufacturing capability.
- Lead yield analysis, parametric trend monitoring, root-cause investigations, and data-driven cost, yield, and cycle-time improvements.
- Own manufacturing release, qualification execution, product change management (PCNs), and serve as technical escalation owner for production issues and customer returns.
What you'll need
- Bachelor’s degree in Electrical Engineering, Computer Engineering, or a related field.
- 8+ years of experience in semiconductor product engineering, manufacturing engineering, or test engineering with ownership from NPI through high-volume production.
- Strong technical depth in semiconductor power products and advanced power module manufacturing.
- Data analysis skills to interpret statistical results and drive decisions.
- Working knowledge of new product development, qualification, and high-volume manufacturing transfer.
Nice to have
- Master’s degree in a relevant engineering discipline.
- Mechanical Engineering degree, particularly for roles involving module packaging, thermomechanical behavior, and assembly optimization.
More semiconductor jobs: Renesas Electronics jobs · Hardware design jobs
First seen in our index 99 days ago, well above the 45-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1176
|
Median days since first seen
45 d
|
Category median salary (all employers)
$148k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Renesas Electronics | All employers we track in this specialty (1176 roles · 112 employers) |
|---|---|---|
| Open roles in this specialty | 17 | 1176 |
| Open roles in the wider Software, Firmware & Systems family | 119 | 6705 · 161 employers |
| Median days since first seen | 51 d | 45 d (−6 d vs this employer) |
| Median salary (USD postings) | n/a | $148k |
Who's hiring in this category
- Intel Corporation · 95 open roles · median 31 d
- KLA Corporation · 66 open roles · median 63 d
- Applied Materials · 64 open roles · median 36 d
- NVIDIA · 62 open roles · median 76 d
- ASML · 59 open roles · median 21 d
- Teradyne · 57 open roles · median 55 d
How we counted: 1176 open Hardware Systems Engineering (AI ML Hardware) roles from 112 employers tracked in the SemiconductorJobs index, counted 13 Nov 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there, and is counted in the wider Software, Firmware & Systems family row. Days are counted from when our index first saw each posting, not from the employer's original posting date.