Module Excellence Principal Engineer (Mult. Pos.) - Job# 6862 - USA-Arizona, United States
Originally posted 24 April 2026 by the employer.
About the role
As a Module Excellence Principal Engineer, you will sustain semiconductor engineer systems automation in technology nodes from 3nm to 5nm, maintaining system settings and troubleshooting daily system issues. You will assist users with workflow design including defect handling and Out of Control Action automations across Lithography, Etching, Thin-film, and Diffusion areas.
What you'll do
- Help users build indices for monitoring system usage performance and success rates using Python, PowerBI, SQL, VBA, and other coding languages. - Lead team members to proactively resolve diverse production line issues while integrating team resources. - Collaborate across Module departments, IT departments, CIM (Computer Integration Manufacturing), Facility, and Logistics to coordinate systematic solutions for production line requirements. - Automate workflows for defect handling, Out of Control Actions, and related process steps.
What you'll need
- Master’s degree or foreign equivalent in Computer Science, Industrial Engineering, Manufacturing Management, Information Systems Management, or a related field, plus 5 years of engineering experience. - 2 years of semiconductor manufacturing experience in technology nodes between 3nm and 5nm. - 3 years of experience in at least 3 of the following manufacturing management systems or indices: Enterprise Management Platform (EMP), Statistical Process Control (SPC), Failure Detection Control (FDC), Tool Automation Protocol (TAP), Engineering Workflow automation (WFA), or Manufacturing Executive System (MES). - 3 years of experience in Python, SQL, PowerBI, and VBA. - 2 years of experience automating workflows to increase operational efficiency. - 2 years of experience managing engineering teams. - Willingness and ability to work on-site at the Phoenix, Arizona facility.
This role has been open 163 days — well above the 51-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1017
|
Median days open
51 d
|
Median salary
$154k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | TSMC Arizona | All employers we track in this specialty (1017 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 9 | 1017 |
| Open roles in the wider Software, Firmware & Systems family | 16 | 6277 · 144 employers |
| Median days open | 163 d | 51 d (+112 d vs this employer) |
| Median salary (USD postings) | — | $154k |
Who's hiring in this category
- Intel Corporation · 75 open roles · median 36 d
- KLA Corporation · 63 open roles · median 50 d
- Teradyne · 61 open roles · median 36 d
- NVIDIA · 51 open roles · median 68 d
- Applied Materials · 48 open roles · median 67 d
- AMD · 43 open roles · median 53 d
How we counted: 1017 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.