Module Engineering PhD Intern - Wet Etch - Oregon, Hillsboro, United States
$120,898 - $120,902 USD yearly
Originally posted 10 September 2026 by the employer.
About the role
As a Module Engineering PhD Intern, you will contribute to the development, optimization, and sustainment of advanced semiconductor manufacturing processes within a specific process module, focusing on wet etch.
What you'll do
- Support the development, implementation, optimization, and sustainment of semiconductor manufacturing processes within a specific module area.
- Troubleshoot, maintain, and qualify manufacturing equipment to ensure process stability, reliability, and performance.
- Analyze process and equipment performance data to identify opportunities for improvement and drive corrective actions.
- Collaborate with cross-functional engineering teams to improve process control methodologies, operational efficiency, yield, and quality.
- Investigate and resolve process and equipment-related issues affecting manufacturing operations.
- Apply scientific and engineering principles to solve technical challenges in a high-volume manufacturing environment.
What you'll need
- Currently pursuing a PhD in Chemistry, Physics, Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, or a related scientific or engineering discipline.
- Demonstrated knowledge of semiconductor manufacturing, materials processing, device fabrication, or related technologies through academic research, coursework, laboratory work, or industry experience.
- Experience applying scientific and engineering methodologies to solve technical problems.
- Strong analytical, troubleshooting, and problem-solving skills.
Nice to have
- Cumulative GPA of 3.0 or higher.
- 3+ months of educational, research, laboratory, internship, or industry experience.
- Experience with data analysis, statistical methods, modeling, simulation, automation, or visualization tools such as Python, MATLAB, SQL, JMP, R, or equivalent platforms.
- Experience leveraging AI and Large Language Models (LLMs) in research, engineering, or productivity workflows, including tools such as Microsoft Copilot or Google Gemini.
- Research, coursework, projects, publications, or internship experience related to semiconductor technology, advanced manufacturing, process development, materials science, device physics, or data analytics.
- Strong written and verbal communication skills with the ability to communicate technical concepts and findings effectively.
- Demonstrated ability to work collaboratively in a team-based environment while managing multiple priorities.
This role has been open 36 days — well below the 50-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
966
|
Median days open
50 d
|
Median salary
$156k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (966 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 73 | 966 |
| Open roles in the wider Software, Firmware & Systems family | 205 | 6119 · 145 employers |
| Median days open | 35 d | 50 d (−15 d vs this employer) |
| Median salary (USD postings) | — | $156k |
Who's hiring in this category
- Intel Corporation (this employer) · 74 open roles · median 35 d
- KLA Corporation · 65 open roles · median 43 d
- Teradyne · 57 open roles · median 29 d
- NVIDIA · 52 open roles · median 67 d
- Applied Materials · 50 open roles · median 65 d
- AMD · 47 open roles · median 49 d
How we counted: 966 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 17 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.