Module Engineering - Day Shift 5 or 7 - Arizona, Phoenix, United States
$85,200 - $162,500 USD yearly
Originally posted 21 July 2026 by the employer. Relisted by the employer on 13 October 2026.
About the role
As a Module Engineer within Intel's Foundry Technology Manufacturing business unit, you will develop and optimize assembly processes and equipment for foundry packaging platform technologies. The position operates on a compressed work week day shift schedule (Shift 5 or Shift 7).
What you'll do
- Design, develop, and optimize assembly processes and equipment to meet quality, reliability, cost, yield, productivity, and manufacturability requirements. - Define process and equipment specifications using Design of Experiments (DOE) and data analysis principles, documenting findings in technical white papers. - Develop and maintain equipment used to evaluate silicon and package technologies under simulated field conditions, including thermal cycling, heat, humidity, and dynamic mechanical stress testing. - Oversee the full cycle of package manufacturing processes, procedures, and production flows while ensuring physical package designs are manufacturable. - Establish material specifications for contract assemblers and raw material vendors, enforcing process compliance and vendor performance standards. - Create reliability screening techniques and acceleration methods to enable early detection of packaging quality and reliability risks.
What you'll need
- US Citizenship. - Bachelor's degree with 1+ years of experience in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a STEM-related field, OR a Master's degree in the same disciplines. - 6+ months of experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
Nice to have
- Prior experience working in a technology or semiconductor manufacturing environment. - Experience in semiconductor packaging processes, including assembly, materials, or reliability engineering within a foundry context.
This role has been open 89 days — well above the 63-day median for Packaging Engineering roles.
Packaging Engineering · Advanced Packaging
|
Open roles in category
299
|
Median days open
63 d
|
Median salary
$167k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (299 roles · 59 employers) |
|---|---|---|
| Open roles in this specialty | 17 | 299 |
| Open roles in the wider Process, Fab & Equipment family | 184 | 9979 · 109 employers |
| Median days open | 63 d | 63 d (same as this employer) |
| Median salary (USD postings) | — | $167k |
Who's hiring in this category
- KLA Corporation · 43 open roles · median 130 d
- Micron Technology · 38 open roles · median 39 d
- Renesas Electronics · 17 open roles · median 49 d
- Intel Corporation (this employer) · 16 open roles · median 43 d
- GlobalFoundries · 14 open roles · median 62 d
- Infineon Technologies · 14 open roles · median 68 d
How we counted: 299 open Packaging Engineering (Advanced Packaging) roles from 59 employers tracked in the SemiconductorJobs index, counted 19 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.