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Intel Corporation

Module Engineer On-Shift (MEOS) – Day Shift (5) - Arizona, Phoenix, United States

Intel Corporation US, Arizona, Phoenix, United States 5 days ago
Digital Design & SoC Architecture

$99,030 - $139,810 USD yearly

Originally posted 5 October 2026 by the employer.

About the role

This role involves providing real-time factory support for 24x7 manufacturing operations, ensuring seamless lot movement through the production line. You will contribute to advanced packaging solutions within the Substrate Packaging Technology Development (SPTD) organization.

What you'll do

  • Provide hands-on, real-time support for equipment, process, and product issues to maintain continuous lot movement.
  • Receive and deliver comprehensive pass-downs to incoming and outgoing shift teams, aligning priorities with management.
  • Respond promptly to process issues, perform error recovery, and manage lot disposition.
  • Write and update specifications and RFCs (Request for Change) to maintain accurate process records.
  • Execute non-standard procedures and perform inspection and imaging on panels to collect development data.
  • Communicate effectively with Tool and Lot Owners regarding key issues for timely resolution.

What you'll need

  • Bachelor's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline with 2+ years of relevant experience OR Master's degree in Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or a related discipline.
  • Experience with Metrology Tools.
  • Exposure to Lithography tools.
  • Experience with Laser Tools.

Nice to have

  • 2+ years of experience in Statistical Process Control (SPC).
  • 2+ years of experience in Metrology tool recipe creation.
  • 2+ years of experience in Metrology tool troubleshooting.
  • 2+ years of experience in Semiconductor Packaging or Packaging Substrate Manufacturing.
Market context

This role has been open 3 days — well below the 50-day median for Hardware Systems Engineering roles.

Hardware Systems Engineering · AI ML Hardware

Open roles in category
939
Median days open
50 d
Median salary
$157k
See the full market breakdown ▾Category comparison, and who else is hiring
How Intel Corporation compares in Hardware Systems Engineering hiring
Metric Intel Corporation All employers we track in this specialty (939 roles · 103 employers)
Open roles in this specialty 70 939
Open roles in the wider Software, Firmware & Systems family 188 6047 · 146 employers
Median days open 28 d 50 d (−22 d vs this employer)
Median salary (USD postings) — $157k

Who's hiring in this category

  • Intel Corporation (this employer) · 70 open roles · median 27 d
  • KLA Corporation · 57 open roles · median 41 d
  • NVIDIA · 53 open roles · median 63 d
  • Teradyne · 47 open roles · median 21 d
  • Applied Materials · 46 open roles · median 58 d
  • AMD · 44 open roles · median 61 d

How we counted: 939 open Hardware Systems Engineering (AI ML Hardware) roles from 103 employers tracked in the SemiconductorJobs index, counted 9 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.

Apply now
US, Arizona, Phoenix, United States
On-site
$99,030 - $139,810 USD yearly
5 days ago

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