Module Engineer On Shift (MEOS) - Arizona, Phoenix, United States
$85,200 - $162,500 USD yearly
Originally posted 16 October 2026 by the employer.
About the role
This role involves developing and optimizing assembly and packaging processes for Intel's semiconductor products.
What you'll do
- Optimize manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability requirements.
- Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to create and refine process and equipment specifications.
- Conduct tests under simulated field conditions to evaluate silicon and package technologies.
- Oversee the manufacturability of package designs and manage the full lifecycle of packaging processes, procedures, and workflows.
- Develop innovative techniques, tools, and quality screens to identify packaging quality and reliability issues early in the development cycle.
What you'll need
- Bachelor’s degree in mechanical engineering, materials science engineering, chemical engineering, electrical engineering, applied technology or a related field.
- 2+ years of hands-on experience in assembly and packaging technologies or technology manufacturing.
Nice to have
- 2+ years of experience in Statistical Process Control (SPC) and Design of Experiments (DOE) principles.
- 2+ years of experience in laser, optical systems, or semiconductor assembly processes.
- 2+ years of experience in a technology manufacturing or semiconductor packaging environment.
- 2+ years of experience in equipment adjustment, process characterization, and manufacturability in semiconductor or electronics assembly settings.
- 2+ years of experience in data science and statistics tools such as Python, JMP, or Minitab for data analysis and visualization.
This role has been open 0 days — well below the 51-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
953
|
Median days open
51 d
|
Median salary
$156k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Intel Corporation | All employers we track in this specialty (953 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 74 | 953 |
| Open roles in the wider Software, Firmware & Systems family | 204 | 6157 · 145 employers |
| Median days open | 35 d | 51 d (−16 d vs this employer) |
| Median salary (USD postings) | — | $156k |
Who's hiring in this category
- Intel Corporation (this employer) · 68 open roles · median 34 d
- KLA Corporation · 64 open roles · median 44 d
- Teradyne · 56 open roles · median 28 d
- NVIDIA · 51 open roles · median 67 d
- Applied Materials · 49 open roles · median 64 d
- AMD · 47 open roles · median 48 d
How we counted: 953 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 16 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.