Microelectronics / Semiconductor Packaging Co-Op - Nashua, NH, United States
$26 - $47 USD yearly
About the role
This Co-Op/Intern position supports the development of advanced microelectronic packaging technologies. The role provides hands-on experience in semiconductor packaging, materials evaluation, process development, failure analysis, and engineering data analysis.
What you'll do
- Support microelectronics packaging development and manufacturing projects.
- Evaluate and characterize packaging materials, including adhesives, mold compounds, substrates, underfills, and thermal interface materials.
- Assist with package assembly process development, optimization, and documentation.
- Collect, analyze, and present technical data to support engineering decisions.
- Assist with failure analysis investigations and root cause identification.
- Collaborate with cross-functional teams and external OSAT partners.
What you'll need
- Pursuing a Bachelor's or Master's degree in Mechanical Engineering, Chemical Engineering, Materials Science Engineering, Industrial Engineering, Electrical Engineering, or Electronics and Computer Engineering.
- Junior or Senior standing, or current graduate student.
- Proficiency with Microsoft Office applications, particularly Excel, Word, and PowerPoint.
Nice to have
- Basic knowledge of semiconductor packaging, materials characterization, manufacturing processes, or failure analysis.
- Familiarity with statistical analysis, DOE methodologies, or data analysis tools such as Minitab, JMP, MATLAB, or Python.
- Experience with CAD tools such as SolidWorks, Creo, or AutoCAD.
Skills: advanced microelectronic packaging, packaging materials, assembly process development, failure analysis, OSAT
This role has been open 4 days — well below the 65-day median for Packaging Engineering roles.
Packaging Engineering · Packaging
|
Open roles in category
199
|
Median days open
65 d
|
Median salary
$166k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Skyworks | All employers we track in this specialty (199 roles · 41 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 199 |
| Open roles in the wider Process, Fab & Equipment family | 106 | 9328 · 108 employers |
| Median days open | 32 d | 65 d (−33 d vs this employer) |
| Median salary (USD postings) | — | $166k |
Skills observed across this category: advanced microelectronic packaging, packaging materials, assembly process development, failure analysis, OSAT
Who's hiring in this category
- Infineon Technologies · 28 open roles · median 30 d
- Micron Technology · 19 open roles · median 141 d
- Renesas Electronics · 19 open roles · median 23 d
- Intel Corporation · 12 open roles · median 147 d
- Monolithic Power Systems · 12 open roles · median 183 d
- onsemi · 7 open roles · median 63 d
How we counted: 199 open Packaging Engineering (Packaging) roles from 41 employers tracked in the SemiconductorJobs index, counted 19 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Process, Fab & Equipment family row. Figures refresh nightly.