Memory Package Integration Architect - United States
$143,000 - $398,000 USD yearly
Originally posted 10 September 2026 by the employer — open 9 days.
This role focuses on advanced packaging technologies for memory systems, from datacenter to edge-AI.
About the role
It focuses on packaging complex memory systems for datacenter and edge-AI applications.
What you'll do
- Lead cross-stack co-optimization across silicon, package, board, and system with a package-centric solutions approach.
- Drive long-term memory technology packaging strategy and influence industry standards.
- Serve as a technical interface to internal partners, customers, BUs, senior leaders.
- Develop AI based multi-physics solutions for efficiency gains.
What you'll need
- Master’s degree or equivalent practical experience in EE, CE, CS, or related field.
- 6+ years of extensive hands-on experience in memory systems package design, signaling, IO design, PDN design.
- Deep understanding of memory timing, signaling, power, package process technology.
- Working knowledge of EDA tools for design, analysis and simulation of electronic packaging, including Cadence, Siemens and Ansys tools.
- Experience applying AI or LLMs for engineering efficiency.
Nice to have
- Master’s degree or PhD in a related technical field.
- Recognized technical leadership across multiple products.
- Experience in Signal and Power integrity analysis and mechanical and reliability analysis, thermal analysis.
- Expertise in memory systems architecture.
Skills: next-generation package pathfinding, system architectures, memory technology packaging strategy, cross-stack co-optimization, package design, signaling
This role has been open 9 days — well below the 37-day median for Chiplet/Advanced Packaging Design roles.
Chiplet/Advanced Packaging Design · Advanced Packaging
|
Open roles in category
67
|
Median days open
37 d
|
Median salary
$187k
|
See the full market breakdown ▾Category comparison, skills in demand, and who else is hiring
| Metric | Micron Technology | All employers we track in this specialty (67 roles · 24 employers) |
|---|---|---|
| Open roles in this specialty | 13 | 67 |
| Median days open | 142 d | 37 d (+105 d vs this employer) |
| Median salary (USD postings) | — | $187k |
Skills observed across this category: next-generation package pathfinding, system architectures, memory technology packaging strategy, cross-stack co-optimization, package design, signaling
Who's hiring in this category
- Micron Technology (this employer) · 13 open roles · median 142 d
- AMD · 6 open roles · median 26 d
- Marvell Technology · 6 open roles · median 12 d
- Broadcom · 5 open roles · median 162 d
- NVIDIA · 5 open roles · median 37 d
- Amazon · 4 open roles · median 25 d
How we counted: 67 open Chiplet/Advanced Packaging Design (Advanced Packaging) roles from 24 employers tracked in the SemiconductorJobs index, counted 20 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there. Figures refresh nightly.