Memory/Advanced Packaging Strategy Technologist

Originally posted 26 August 2026 by the employer.

About the role

This role leads Memory Technology Roadmap and Strategy supporting the Varian Business Unit of the Silicon Products Group. The Varian Business Unit develops solutions for implant, patterning, packaging, and photonics applications.

What you'll do

• Understand industry technology roadmaps, key pathfinding activities, and translate memory technology inflections into process equipment requirements.
• Collaborate with marketing, technical, and engineering teams to identify key challenges for future memory technologies, focusing on Memory and Advanced Packaging.
• Provide integrated demo and integration support to Business Units and write and file IP to protect developed integration solutions.
• Support nodal sizing, forecasting, and market share analysis for Business Units while evaluating technology changes and inflections.
• Track customer investment plans, competitor strategies, and inflection segments to evaluate penetration opportunities and develop technical collateral.
• Construct executive presentations and communications for internal, corporate, and external audiences.

What you'll need

• Advanced degree (M.S./Ph.D.) in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or related fields.
• At least 5 years of semiconductor processing experience as a lead process integration engineer or device engineer.
• Technical understanding of Memory technologies including DRAM and NAND, along with knowledge of process integration and device physics.
• Strong data analysis, presentation, and cross-functional communication capabilities.

Nice to have

• Understanding of advanced packaging processes and integration schemes.
• Knowledge of AI applications for engineering process optimization.

Skills: technology roadmap, market sizing, forecasting, memory technologies, advanced packaging

More semiconductor jobs: Applied Materials jobs