Mechanical Simulation Engineer - San Jose, CA, United States

Originally posted 2 October 2026 by the employer.

This role focuses on advanced packaging solutions like HBM and 2.5D/3D Heterogeneous Integration.

About the role

The focus includes HBM and 2.5D/3D Heterogeneous Integration packaging.

What you'll do

• Develop high-fidelity, non-linear Finite Element Analysis (FEA) models to characterize stress, strain, and warpage behavior.
• Perform complex thermo-mechanical multi-physics simulations to evaluate thermal gradient impact on structural integrity and fatigue life.
• Partner with package designers and process engineers to provide simulation-driven design directions for warpage control, solder joint reliability, and interfacial adhesion.
• Define and implement material constitutive models (elastic, plastic, viscoelastic, etc.) and correlate simulation results with empirical data (e.g., Shadow Moire, DIC).
• Predict potential failure modes (delamination, cracking, bump fatigue) and develop mitigation strategies to meet reliability standards.
• Evaluate thermo-mechanical interactions between advanced packages and board/system-level components (e.g., Motherboard, Rack, Cooling systems).

What you'll need

• Master’s degree or higher in Mechanical Engineering, Materials Science, or a related field.
• Deep understanding of solid mechanics, heat transfer, and strength of materials, specifically applied to semiconductor packaging.
• Extensive experience with commercial FEA software such as ABAQUS, ANSYS Mechanical, or LS-DYNA.
• Proven knowledge of semiconductor packaging structures (Flip-chip, WLCSP, 2.5D/3D IC) and the physics of failure in electronic assemblies.
• Ability to interpret complex simulation data and translate it into actionable engineering recommendations.
• Experience or strong knowledge in mechanical simulation/testing at the system or set level, with preferred exposure to data center rack architectures, desktop form factors, or enterprise-level hardware systems.

Nice to have

• Experience in Multi-scale modeling (from micro-scale TSV/micro Bumps to macro-scale Package/PCB).
• Strong scripting skills in Python to automate Abaqus workflows, including pre-processing, job submission, and customized post-processing/data extraction.
• Proficiency in statistical analysis and DOE (Design of Experiments) using tools such as JMP or Minitab.
• Knowledge of semiconductor manufacturing processes (Reflow, Molding, Bonding) and their impact on residual stress.
• Experience with CAD software (NX, Solidworks, or AutoCAD) for geometry preparation and cleaning.