Mechanical Engineering Internship – Summer 2027 - San Diego, California, United States of America
Originally posted 18 September 2026 by the employer — open 2 days.
About the role
This internship involves designing, simulating, and testing mechanical and thermal systems that support Qualcomm's advanced semiconductor technologies.
What you'll do
- Design, simulate, and test mechanical and thermal systems.
- Contribute to projects involving IC packaging, chip/package co-design, and thermal modeling.
- Work on signal and power integrity aspects of mechanical systems.
What you'll need
- Currently enrolled in a bachelor’s, master’s, or Ph.D. degree program in mechanical engineering, materials science, or a related field.
- Availability for 11–14 weeks during Summer 2027 (May–September).
- Expected graduation date of November 2027 or later.
- 1 year of academic experience with programming languages such as Python, Matlab.
Nice to have
- Familiarity with Cadence Sip, AutoCAD, and Solidworks.
- Coursework in Solid Mechanics, Mechanics of Materials, and Finite Element Analysis (FEA).
- Knowledge of IC packaging structures, chip-package interaction, and electronic packaging processes.
- Experience with thermal system design, modeling, and testing.
- Understanding of heat transfer, mechanical design, and microelectronics.
- Exposure to server product design, system impedance testing, fan performance measurement, and heatsink design methodology.
- Experience with Computational Fluid Dynamics (CFD), wind tunnel, and/or airflow bench operation.
This role has been open 1 day — well below the 44-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
832
|
Median days open
44 d
|
Median salary
$159k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Qualcomm | All employers we track in this specialty (832 roles · 100 employers) |
|---|---|---|
| Open roles in this specialty | 37 | 832 |
| Open roles in the wider Software, Firmware & Systems family | 718 | 5787 · 143 employers |
| Median days open | 39 d | 44 d (−5 d vs this employer) |
| Median salary (USD postings) | — | $159k |
Who's hiring in this category
- Intel Corporation · 55 open roles · median 22 d
- NVIDIA · 53 open roles · median 44 d
- KLA Corporation · 48 open roles · median 38 d
- AMD · 43 open roles · median 47 d
- Applied Materials · 43 open roles · median 59 d
- Teradyne · 42 open roles · median 50 d
How we counted: 832 open Hardware Systems Engineering (AI ML Hardware) roles from 100 employers tracked in the SemiconductorJobs index, counted 20 Sept 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.