Mechanical Engineer - USA-CA San Jose Innovation Drive, United States
$121,900 USD yearly
Originally posted 18 August 2026 by the employer.
About the role
This role involves the design of system enclosures and liquid cooling infrastructure for high-power systems within the Compute and Switching Group.
What you'll do
- Lead thermo-mechanical lab operations, including liquid cooling infrastructure and BGA socket thermal validation.
- Own thermo-mechanical system component validation and troubleshooting from concept through production.
- Develop and qualify advanced thermal solutions such as heatsinks, vapor chambers, and liquid cooling through vendor collaboration.
- Conduct system-level thermal tests and correlate results with simulations.
- Design rack-mount enclosures and system components based on production requirements, collaborating with cross-functional teams.
- Manage vendor relationships for thermal solution components like heatsinks, manifolds, and cooling hardware.
- Troubleshoot and resolve system-level thermal issues in high-power prototypes.
What you'll need
- Bachelor’s degree in Mechanical Engineering or related field with 8+ years of experience in enclosure design and thermal test validation.
- Proficiency in PTC Creo and Windchill PLM.
- Strong background in heatsinks, heat pipes, vapor chambers, and liquid cooling systems.
- Hands-on experience with thermal measurement technologies, sensors, and lab instrumentation.
- Knowledge of datacenter rack standards (EIA-310, OCP).
- Familiarity with EMI/EMC shielding and compliance design considerations.
- Exposure to compliance and reliability testing (NEBS, shock/vibration, thermal cycling).
- Experience working with global contract manufacturers and suppliers from prototype to volume production.
- Experience with high-speed cabling design and routing (OSFP copper, optical, and internal cables, including bend-radius management, cable retention features, and serviceability within dense rack enclosures).
This role has been open 59 days — slightly above the 51-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
953
|
Median days open
51 d
|
Median salary
$156k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Broadcom | All employers we track in this specialty (953 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 15 | 953 |
| Open roles in the wider Software, Firmware & Systems family | 79 | 6157 · 145 employers |
| Median days open | 25 d | 51 d (−26 d vs this employer) |
| Median salary (USD postings) | — | $156k |
Who's hiring in this category
- Intel Corporation · 68 open roles · median 34 d
- KLA Corporation · 64 open roles · median 44 d
- Teradyne · 56 open roles · median 28 d
- NVIDIA · 51 open roles · median 67 d
- Applied Materials · 49 open roles · median 64 d
- AMD · 47 open roles · median 48 d
How we counted: 953 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 16 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.