Mechanical Engineer, Systems - Mountain View, California, United States
$170,000 USD yearly
Originally posted 17 September 2026 by the employer.
Own the mechanical design of AI accelerator systems.
About the role
Own the mechanical design of AI accelerator systems from the accelerator board to the tray, rack, and datacenter. You will design power delivery, cooling, and high-speed signal connectivity systems for extremely dense, high-performance computing equipment.
What you'll do
- Design accelerator module mechanics including structure, retention, board and coldplate integration, PCBA co-design and stress analysis, coolant and air flow co-design, and connector definition.
- Design trays for chassis structure, component layout, cable and connector routing, blind-mate alignment, and serviceability.
- Partner with thermal, electrical, packaging, and manufacturing teams on design tradeoffs, and drive DFM and DFA with CM and ODM partners.
- Own products through their lifecycle including design, prototyping, engineering and reliability validation campaigns, New Product Introduction, High Volume Manufacturing, field failure analysis and service.
- Design rack-level mechanical architecture including structure and weight distribution, power and cooling distribution, cable management, and compliance with datacenter rack standards.
- Integrate liquid cooling at system scale, including cold plate mounting, manifold routing, quick disconnects, and leak detection and containment.
- Drive structural and dynamic analysis (FEA, shock and vibration, seismic, shipping) and own tolerance stack-up and GD&T across the module-to-tray-to-rack interfaces.
What you'll need
- Exceptional abilities in system-scale mechanical design for high-power electronics: enclosure and chassis structure, thermal and mechanical integration, and design for service and manufacturability.
- 5+ years of mechanical design experience on datacenter, server, or comparable high-power electronic systems, with demonstrated ownership of a design from concept through high-volume production.
- Highly capable in 3D CAD modeling.
- Proficiency designing for a broad range of low and high-volume manufacturing techniques, including machining, stamping, forming, additive, extrusion, casting, welding, brazing, bonding, injection molding, overmolding, soldering, and other processes.
- Structural, transient, and multiphysics analysis skills including finite element analysis.
- Demonstrated ability to work closely with thermal, electrical, packaging, and manufacturing teams, and with CM and ODM partners, to converge and release system designs.
- Skilled in mechanical tolerance analysis, GD&T, and mechanical drawing creation.
- Engineering validation test campaign definition and ownership.
- Strong design documentation and organizational discipline including experience releasing and revising detailed engineering drawings and managing documentation in PLM systems to ensure that manufactured parts meet engineering specifications and have adequate traceability.
Nice to have
- Experience with OCP and EIA-310 rack standards.
- Experience with OAM / UBB or comparable accelerator module form factors.
- Experience with liquid cooling and manifold integration.
- Experience with high-current busbar and power distribution mechanical.
- Experience with seismic and shipping qualification.
This role has been open 25 days — well below the 49-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
946
|
Median days open
49 d
|
Median salary
$158k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | DensityAI | All employers we track in this specialty (946 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 5 | 946 |
| Open roles in the wider Software, Firmware & Systems family | 10 | 6116 · 146 employers |
| Median days open | 32 d | 49 d (−17 d vs this employer) |
| Median salary (USD postings) | — | $158k |
Who's hiring in this category
- Intel Corporation · 72 open roles · median 31 d
- KLA Corporation · 62 open roles · median 41 d
- Applied Materials · 49 open roles · median 61 d
- NVIDIA · 49 open roles · median 67 d
- Teradyne · 48 open roles · median 25 d
- AMD · 47 open roles · median 46 d
How we counted: 946 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 13 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.