$147,000 - $202,500 USD yearly
Originally posted 20 May 2026 by the employer.
About the role
This role leads end-to-end mechanical system design for semiconductor equipment, translating product and module requirements into architectures focused on system integration, fluid handling, and operating environments. The position supports wet process and electrochemical systems such as copper plating and wafer cleaning.
What you'll do
- Lead end-to-end mechanical system design for semiconductor equipment, focusing on system integration, fluid handling, and operating environments. - Drive engineering execution from concept through release, including design, analysis, supplier engagement, build, and validation of complex mechanical and fluid subsystems. - Define and optimize system-level design tradeoffs across performance, reliability, manufacturability, cost, and serviceability. - Design mechanical and fluid delivery subsystems, create layouts, schematics, and specifications, and ensure appropriate material selection. - Perform and validate thermal, structural, tolerance, and flow/fluids engineering analyses using first-principles calculations and simulation tools (FEA/CFD). - Plan and execute structured validation tests, characterize operating windows, establish design margins, and analyze data using tools such as JMP and MS Excel. - Create, specify, and review engineering documentation and manage releases through PLM systems such as Teamcenter.
What you'll need
- Master's degree or PhD in mechanical engineering with 5–7 years of applicable experience. - Experience in semiconductor equipment design or troubleshooting. - Proficiency with 3D CAD tools such as Siemens NX, Creo (Pro/ENGINEER), or SolidWorks. - Demonstrated strength in at least one technical domain: thermal engineering, compressible flow, mechanical design, or machining/manufacturing processes. - Experience with statistical data analysis tools such as JMP and MS Excel.
Nice to have
- Experience with wet process or electrochemical systems (e.g., copper plating, wafer cleaning). - Experience with engineering analysis tools and FEA packages such as ANSYS, CFD ACE, or COMSOL.
This role has been open 156 days — well above the 51-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1017
|
Median days open
51 d
|
Median salary
$154k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | Applied Materials | All employers we track in this specialty (1017 roles · 102 employers) |
|---|---|---|
| Open roles in this specialty | 47 | 1017 |
| Open roles in the wider Software, Firmware & Systems family | 156 | 6277 · 144 employers |
| Median days open | 64 d | 51 d (+13 d vs this employer) |
| Median salary (USD postings) | — | $154k |
Who's hiring in this category
- Intel Corporation · 75 open roles · median 36 d
- KLA Corporation · 63 open roles · median 50 d
- Teradyne · 61 open roles · median 36 d
- NVIDIA · 51 open roles · median 68 d
- Applied Materials (this employer) · 48 open roles · median 67 d
- AMD · 43 open roles · median 53 d
How we counted: 1017 open Hardware Systems Engineering (AI ML Hardware) roles from 102 employers tracked in the SemiconductorJobs index, counted 24 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.