Mechanical Engineer - CA, San Jose, United States
Originally posted 3 September 2026 by the employer.
Develop mechanical solutions and thermo-mechanical modeling for semiconductor packages across AI, HPC, FPGA, ASIC, and SoC products using Creo and ANSYS Mechanical.
About the role
AMD's Advanced Packaging team is developing packaging and cooling solutions for AI, HPC, FPGA, ASIC, and SoC products. In this role, you will work closely with packaging architects, suppliers, and manufacturing partners to develop mechanical solutions for semiconductor packages from concept through production.
What you'll do
- Support development of semiconductor packaging solutions for AI, HPC, FPGA, ASIC, and SoC products. - Drive mechanical design activities including CAD modeling, tolerance analysis, fit checks, and DFM reviews. - Collaborate with suppliers and contract manufacturers to develop manufacturable packaging solutions and define design requirements. - Review and evaluate mechanical designs, simulations, drawings, and engineering changes to ensure product quality and manufacturability. - Support thermo-mechanical modeling and package integration activities using tools such as Creo and ANSYS Mechanical. - Contribute to chip, package, board, and system-level integration efforts alongside packaging, thermal, reliability, manufacturing, and supply-chain teams.
What you'll need
- MS or PhD in Mechanical Engineering, Materials Engineering, Electrical Engineering, Applied Mechanics, or a related technical field (or equivalent industry experience). - Semiconductor packaging experience supporting ASIC, SoC, FPGA, CPU, GPU, AI, or HPC products. - Experience with mechanical design, CAD modeling, GD&T, tolerance analysis, DFM, and design reviews. - Familiarity with thermo-mechanical modeling using ANSYS Mechanical or similar tools. - Understanding of chip-package interaction, package-board interaction, and semiconductor package integration. - Experience working with suppliers, contract manufacturers, or packaging development partners.
Nice to have
- Experience with advanced cooling solutions, thermal technologies, or emerging packaging materials.
This role has been open 49 days — below the 51-day median for Hardware Systems Engineering roles.
Hardware Systems Engineering · AI ML Hardware
|
Open roles in category
1003
|
Median days open
51 d
|
Median salary
$155k
|
See the full market breakdown ▾Category comparison, and who else is hiring
| Metric | AMD | All employers we track in this specialty (1003 roles · 104 employers) |
|---|---|---|
| Open roles in this specialty | 45 | 1003 |
| Open roles in the wider Software, Firmware & Systems family | 400 | 6298 · 145 employers |
| Median days open | 51 d | 51 d (same as this employer) |
| Median salary (USD postings) | — | $155k |
Who's hiring in this category
- Intel Corporation · 72 open roles · median 34 d
- KLA Corporation · 63 open roles · median 48 d
- Teradyne · 61 open roles · median 34 d
- NVIDIA · 53 open roles · median 72 d
- Applied Materials · 51 open roles · median 70 d
- AMD (this employer) · 46 open roles · median 52 d
How we counted: 1003 open Hardware Systems Engineering (AI ML Hardware) roles from 104 employers tracked in the SemiconductorJobs index, counted 22 Oct 2026. Specialty figures count only roles carrying this exact specialty label, so an employer's related work in neighbouring specialties is not included there — it is counted in the wider Software, Firmware & Systems family row. Figures refresh nightly.